參數(shù)資料
型號: TDA8505
廠商: NXP SEMICONDUCTORS
元件分類: 顏色信號轉(zhuǎn)換
英文描述: SECAM encoder
中文描述: COLOR SIGNAL ENCODER, PDIP32
封裝: PLASTIC, SOT-232-1, SDIP-32
文件頁數(shù): 28/32頁
文件大小: 466K
代理商: TDA8505
July 1994
28
Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
SOLDERING
Plastic dual in-line packages
B
Y DIP OR WAVE
The maximum permissible temperature of the solder is
260
°
C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron below the seating plane
(or not more than 2 mm above it). If its temperature is
below 300
°
C, it must not be in contact for more than 10 s;
if between 300 and 400
°
C, for not more than 5 s.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
相關(guān)PDF資料
PDF描述
TDA8510 26 W BTL and 2 x 13 W SE power amplifiers
TDA8510J 26 W BTL and 2 x 13 W SE power amplifiers
TDA8511 4 x 13 W single-ended power amplifiers
TDA8511J 4 x 13 W single-ended power amplifiers
TDA8541 1 W BTL audio amplifier
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA8510 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:26 W BTL and 2 x 13 W SE power amplifiers
TDA8510J 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:26 W BTL and 2 x 13 W SE power amplifiers
TDA8510J/N2,112 功能描述:音頻放大器 AMP POWER 26W 17-SIL RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA8511 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:4 x 13 W single-ended power amplifiers
TDA8511J 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:4 x 13 W single-ended power amplifiers