參數(shù)資料
型號(hào)： TDA8020HL/C1
廠商： NXP SEMICONDUCTORS
元件分類： 消費(fèi)家電
英文描述： SPECIALTY CONSUMER CIRCUIT, PQFP32
封裝： 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-358-1, LQFP-32
文件頁數(shù)： 7/28頁
文件大小： 137K
代理商： TDA8020HL/C1
2003 Nov 06
15
Philips Semiconductors
Product specication
Dual IC card interface
TDA8020HL
Clock inputs and data inputs/outputs to the system controller
CLKIN1 is the input clock for card 1, CLKIN2 for card 2. They may be driven separately from the system controller, or be
tied together externally and driven by the same signal.
I/O1uC is the data signal to or from card 1, I/O2uC to or from card 2. They can be driven separately from the system
controller, in which case both bits I/OEN may be set to logic 1. They can also be driven by the same signal, which
requires them to be tied together externally, but each bit I/OEN has to be set or reset according to the addressed card.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. HBM: EIA/JESD22-A 114-B; June 2000.
2. All card contacts are protected against any short-circuit with any other card contact.
3. MM: EIA/JESD22-A 115-A; October 1997.
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However it is good practice to take
normal precautions appropriate to handling MOS devices (see
“Handling MOS devices”).
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITION
MIN.
MAX.
UNIT
VDD
supply voltage on pins VDD and VDDA
0.5
+6.5
V
VDDI
supply voltage for interface signals
0.5
+6.5
V
Vn
input voltage
on pins SAP, SAM, SBP, SBM and VUP
0.5
+7.5
V
on pins SDA and SCL
0.5
+6.5
V
on all other pins
0.5
VDD + 0.5
V
Ptot
total power dissipation
Tamb = 40 °C to +85 °C
500
mW
Tstg
storage temperature
55
+150
°C
Tj
junction temperature
125
°C
Vesd
electrostatic discharge voltage
HMB; note 1
all card contact pins
within the typical
application; note 2
6+6
kV
pins VDDA and VDDI
0.5
+0.5
kV
all other pins
2+2
kV
MM; note 3
all pins
200
+200
V
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
in free air
80
K/W
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