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參數(shù)資料
| 型號： | TC1300 |
| 廠商： | Microchip Technology Inc. |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | 300 mA CMOS LDO with Shutdown, Bypass and Independent Delayed Reset Function |
| 中文描述： | 300毫安的CMOS低壓降穩(wěn)壓器，帶有關(guān)斷，繞道和獨(dú)立延遲復(fù)位功能 |
| 文件頁數(shù)： | 9/16頁 |
| 文件大小： | 326K |
| 代理商： | TC1300 |
2002 Microchip Technology Inc.
DS21385C-page 9
TC1300
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the regula-
tor off when the die temperature exceeds 150°C. The
regulator remains off until the die temperature drops to
approximately 140°C.
4.2
Power Dissipation
The amount of power the regulator dissipates is prima-
rily a function of input and output voltage, and output
current. The following equation is used to calculate
worst case
actual
power dissipation:
EQUATION
The maximum allowable power dissipation, P
DMAX
, is a
function of the maximum ambient temperature (T
AMAX
),
the maximum recommended die temperature (125°C)
and the thermal resistance from junction-to-air (
θ
JA
).
The MSOP-8 package has a
θ
JA
of approximately
200°C/Watt when mounted on a FR4 dielectric copper
clad PC board.
EQUATION
The worst case actual power dissipation equation can
be used in conjunction with the LDO maximum allow-
able power dissipation equation to ensure regulator
thermal operation is within limits. For example:
Find:
EQUATION:
ACTUAL POWER
DISSIPATION
EQUATION:
MAXIMUM ALLOWABLE
POWER DISSIPATION
In this example, the TC1300 dissipates a maximum of
only 220 mW; below the allowable limit of 350 mW. In a
similar manner, the maximum actual power dissipation
equation and the maximum allowable power dissipa-
tion equation can be used to calculate maximum cur-
rent and/or input voltage limits. For example, the
maximum allowable V
IN
is found by substituting the
maximum allowable power dissipation of 350 mW into
the actual power dissipation equation, from which
V
INMAX
= 4.97V.
4.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads and wide power
supply bus lines combine to lower
θ
JA
and, therefore,
increase the maximum allowable power dissipation
limit.
P
D
V
INMAX
V
OUTMIN
–
(
)
I
LOADMAX
≈
Where:
P
D
= worst case actual power dissipation
V
INMAX
= maximum voltage on V
IN
V
OUTMIN
= minimum regulator output voltage
I
LOADMAX
= maximum output (load) current
P
DMAX
T
-------------------------------------------
T
JA
–
(
)
=
Given:
V
INMAX
V
OUTMIN
I
LOADMAX
T
JMAX
T
AMAX
θ
JA
=
=
=
=
=
=
4.1V
3.0V -2.5%
200 mA
125°C
55°C
200°C/W
P
D
=
=
V
INMAX
4.1
)
–
220 mW
V
OUTMIN
.975
×
–
(
)
I
LOADMAX
200
10
×
≈
(
3.0
(
)
[
]
3
–
P
DMAX
T
-------------------------------------------
T
JA
)
–
(
)
=
-125
–
(
200
=
350 mW
=
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