參數(shù)資料
型號: STW5094ADT/LF
廠商: STMICROELECTRONICS
元件分類: DAC
英文描述: SERIAL INPUT LOADING, 18-BIT DAC, PBGA36
封裝: 6 X 6 MM, 1.2 MM HEIGHT, TFBGA-36
文件頁數(shù): 44/52頁
文件大小: 596K
代理商: STW5094ADT/LF
48/51
TFBGA PACKAGE OUTLINE
Table 2. TFBGA 6x6x1.20 36 F6x6 0.80
(2) TFBGA stands for Thin Profile Fine Pitch Ball Grid Array.
Thin profile: The total profile height (DIm A) is measured from the seating plane to the top of the component.
A = 1.01 to 1.20 mm
Fine pitch < 1.00 mm pitch.
(3) The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink, metallized markings or other
feature of package body or integral heatslug.
A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner.
Exact shape of each corner is optional.
Ref
Min.
Typ.
Max.
A1.01
1.20 (1)
1.Max mounted height is 1.16 mm. Based on a 0.37 mm ball pad diameter.
Solder paste is 0.15 mm thick with 0.37 mm diameter.
A1
0.21
A2
0.820
b
0.35
0.40
0.45
D
5.85
6.00
6.15
D1
4.00
E
5.85
6.00
6.15
E1
4.00
e
0.72
0.80
0.88
f
0.85
1.00
1.15
ddd
1.00
相關(guān)PDF資料
PDF描述
STW5094AD/LF SERIAL INPUT LOADING, 18-BIT DAC, PBGA36
SU-1-B3 POWER TRANSFORMER, 1000 VA
SU-1/2-B2 POWER TRANSFORMER, 500 VA
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