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參數(shù)資料
| 型號： | SSTUG32868ET/G |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 鎖存器 |
| 英文描述： | 32868 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA176 |
| 封裝： | 6 X 15 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, MO-246, SOT932-1, TFBGA-176 |
| 文件頁數(shù)： | 19/29頁 |
| 文件大?。?/td> | 166K |
| 代理商： | SSTUG32868ET/G |
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SSTUG32868_1
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 23 April 2007
26 of 29
NXP Semiconductors
SSTUG32868
1.8 V DDR2-1G congurable registered buffer with parity
13.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 24) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 12 and 13
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 24.
Table 12.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 13.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SSTUG32868ETS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.8 V 28-bit 1 : 2 configurable registered buffer with parity for DDR2-1G RDIMM applications |
| SSTUG32868G | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.8 V 28-bit 1 : 2 configurable registered buffer with parity for DDR2-1G RDIMM applications |
| SSTUH32864 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.8 V high output drive configurable registered buffer for DDR2 RDIMM applications |
| SSTUH32864EC | 功能描述:寄存器 1.8V CONFIG REG BUFFER/DDRII RoHS:否 制造商:NXP Semiconductors 邏輯類型:CMOS 邏輯系列:HC 電路數(shù)量:1 最大時鐘頻率:36 MHz 傳播延遲時間: 高電平輸出電流:- 7.8 mA 低電平輸出電流:7.8 mA 電源電壓-最大:6 V 最大工作溫度:+ 125 C 封裝 / 箱體:SOT-38 封裝:Tube |
| SSTUH32864EC,518 | 功能描述:寄存器 1.8V CONFIG REG RoHS:否 制造商:NXP Semiconductors 邏輯類型:CMOS 邏輯系列:HC 電路數(shù)量:1 最大時鐘頻率:36 MHz 傳播延遲時間: 高電平輸出電流:- 7.8 mA 低電平輸出電流:7.8 mA 電源電壓-最大:6 V 最大工作溫度:+ 125 C 封裝 / 箱體:SOT-38 封裝:Tube |
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