參數(shù)資料
型號： SST55LD040M-133-C-BZJE
元件分類： 存儲控制器/管理單元
英文描述： IDE COMPATIBLE, FLASH MEMORY DRIVE CONTROLLER, PBGA145
封裝： 12 X 12 MM, 1.07 MM HEIGHT, ROHS COMPLIANT, TFBGA-145
文件頁數(shù)： 25/39頁
文件大?。?/td> 589K
代理商： SST55LD040M-133-C-BZJE
Advance Information
NAND Controller
SST55LD040M
2010 Silicon Storage Technology, Inc.
S71408-01-000
04/10
31
ELECTRICAL SPECIFICATIONS
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
D.C. Voltage on any pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD/VDDQ+0.5V
Transient Voltage (<20 ns) on any pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . .-2.0V to VDD/VDDQ+2.0V
Package Power Dissipation Capability (TA = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds
Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 mA
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
TABLE 11: Operating Range
Range
Ambient Temperature
VDD
Commercial
0°C to +70°C
3.135-3.465V
Industrial
-40°C to +85°C
3.135-3.465V
T11.0 1408
TABLE 12: AC Conditions of Test
Input Rise/Fall Time . . . . . . . . . . . . . . . . . . . 5 ns
Output Load (FRE#, FWE#) . . . . . . . . . . . . . CL = 180 pF
Output Load (all others) . . . . . . . . . . . . . . . . CL = 50 pF
Note: All AC specifications are guaranteed by design.
TABLE 13: Absolute Maximum Power Pin Stress Ratings
Parameter
Symbol
Conditions
Input Power
VDDQ
-0.3V min to 4.0V max
VDD(core) and VDD(I/O)
-0.3V min to 4.0V max
Voltage on any flash media interface pin with respect to VSS
-0.5V min to VDD + 0.5V max
Voltage on all other pins with respect to VSS
-0.5V min to VDDQ + 0.5V max
T13.0 1408
TABLE 14: Recommended System Power-on Timing
Symbol
Parameter
Typical
Maximum
Units
TPU-INITIAL
Drive Initialization to Ready
7 sec for 16 GByte
1001
1. 100 seconds maximum for 32 GByte
sec
TPU-READ12
2. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
Host Power-on/Reset to Read Operation
700
2000
ms
TPU-WRITE12
Host Power-on/Reset to Write Operation
700
2000
ms
T14.3 1408
TABLE 15: Capacitance (Ta = 25°C, f=1 MHz, other pins open)
Parameter
Description
Test Condition
Maximum
CI/O1
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
I/O Pin Capacitance
VI/O = 0V
15 pF
CIN1
Input Capacitance
VIN = 0V
9 pF
T15.0 1408
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