
Absolute Maximum Ratings
SMH4804
14
2050 3.7 10/30/02
Summit Microelectronics
–
ABSOLUTE MAXIMUM RATINGS
Temperature Under Bias.............................–55°C to 125°C
Power Supply Current (I
DD
).......................................15 mA
Storage Temperature..................................–65°C to 150°C
Lead Solder Temperature (10 seconds) ...................300 °C
Terminal Voltage with Respect to V
SS
:
VGATE ......................................................VDD + 0.3V
A0, A1, A2, MODE, RESET, ENPGA, ENPGB,
ENPGC, FS#, SDA, and SCL..................... -0.3 to +7V
PD1#, PD2#, VDD, UV, OV, CBSENSE, DRAIN
SENSE, EN/TS, FAULT#, PG1#, PG2#, PG3#,
and PG4# ................................................. -0.3 to +15V
Open Drain Output Short Circuit Current.................100 mA
Junction Temperature ...............................................150
o
C
ESD Rating per JEDEC.............................................2000V
Latch-Up testing per JEDEC..................................± 100mA
Stresses listed under Absolute Maximum Ratings may
cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these
or any other conditions outside those listed in the
operational sections of this specification is not implied.
Exposure to any absolute maximum rating for extended
periods may affect device performance and reliability.
–
RECOMMENDED OPERATING CONDITIONS
Temperature Range (Ambient) ................. -40
o
C to +85
o
C
Supply Voltage(V
DD
) (I
DD
= 5 mA)..................... 11V to 13V
Package Thermal Resistance (
θ
JA
) 28-pin SOIC ... 79
o
C/W
Package Thermal Resistance (
θ
JA
) 48-pin TQFP... 80
o
C/W
Moisture Classification Level
3
(MSL
3
) per J-STD-020
Reliability Characteristics
Data Retention.....................................................100 Years
Endurance
1
.................................................100,000 Cycles
+0 //<:7/!