參數(shù)資料
型號(hào): SME5410MCZ-270
元件分類: 微控制器/微處理器
英文描述: 64-BIT, 270 MHz, RISC PROCESSOR, XMA
封裝: 130 X 100 MM, 45 MM HEIGHT MODULE
文件頁數(shù): 15/30頁
文件大小: 183K
代理商: SME5410MCZ-270
22
SME5410MCZ-270
270 MHz CPU, 256 Kbyte E-cache, UPA, 66 MHz PCI
UltraSPARC-IIi CPU Module
July 1998
Sun Microsystems, Inc
Case Temperature Method
The relationship between case temperature and junction temperature is described in the following thermal
equation.
If Tc is known, then Tj can be calculated:
Tj = Tc + (Pd x
θjc)
There is good tracking between the case temperature and the heat sink temperature.
Heatsink Temperature Method (the preferred method)
Measuring the heat sink temperature is sometimes easier than measuring the case temperature. This method
provides accurate results for most designs. If the heatsink temperature (Ts) is known then the following ther-
mal equation can be used to estimate the junction temperature:
Tj = Ts + [Pd (
θjc + θcs)]
Airow Cooling Estimate Method
The relationship between air temperature and junction temperature is described in the following thermal
equation:
Tj = Ta + [Pd (
θjc + θcs + θsa)]
Determination of the ambient air temperature (Ta) and the “free-stream” air velocity is required in order to
apply the airow method. The section "Heatsink-to-Air Thermal Resistance" on page 23, uses the air velocity
direction relative to the heatsink orientation to nd the thermal resistance between the heat sink and air (
θsa).
Note that the airow velocity can be measured using a velocity meter. Alternatively it may be determined by
knowing the performance of the fan that is supplying the airow. Calculating the airow velocity is difcult.
It is subject to interpretation.
Note:
The Airflow Cooling Estimate method is an estimate. Use it solely when an approximate value
suffices. Accuracy can only be assured using the Case Temperature method or the Heatsink
Temperature method. Apply these methods for the greatest accuracy.
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