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| 型號(hào)： | SME5410MCZ-270 |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 270 MHz, RISC PROCESSOR, XMA |
| 封裝： | 130 X 100 MM, 45 MM HEIGHT MODULE |
| 文件頁數(shù)： | 14/30頁 |
| 文件大?。?/td> | 183K |
| 代理商： | SME5410MCZ-270 |
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21
270 MHz CPU, 256 Kbyte E-cache, UPA, 66 MHz PCI
UltraSPARC-IIi CPU Module
SME5410MCZ-270
July 1998
Sun Microsystems, Inc
THERMAL SPECIFICATIONS AND ANALYSIS
Thermal maps of the UltraSPARC-IIi CPU module indicate that by keeping the CPU device cool, the
SRAMs and clock circuitry on the module are also kept cool.
The operating performance of a CPU device is determined by its junction temperature. The CPU temperature
specication may be provided in terms of its junction or case temperature. This section describes how to esti-
mate the case temperature from the airow condition. It also describes how to measure the case temperature
directly in order to verify the cooling design.
Using the Heatsink Temperature method is the preferred verication method. It is distinctly more accurate
than measurements taken using the Airow Cooling Estimate method. The Case Temperature method is
more difcult to perform, but also yields good results.
In all cases, the junction temperature must not exceed the device specication (typically 105
°C). The lower
the junction temperature, the higher the system reliability.
The following table species the terms, denitions and specications used in order to calculate thermal spec-
ications for the UltraSPARC–IIi CPU device.
Thermal Denitions and Specications
Term
Denition
Specication
Tj
Device junction temperature
Can't be measured directly, must always be
estimated at less than 105
°C, lower is
preferred.
Tc
Case temperature
Measurable at the top-center of the device.
Requires a hole in the base of the heatsink to
allow the thermocouple to be in contact with
the case.
Ts
Heatsink temperature
Measurable as the temperature of the base of
the heatsink. Best approach is to embed a
thermocouple in a cavity drilled in the heat-
sink base. An alternative is to place the
thermocouple down between the ns/pins of
the heatsink (insulated from the airow) and
in contact with the base plate of the heatsink.
Ta
Module ambient air temperature
Air temperature as it approaches the heatsink.
Pd
Power dissipation of the CPU
8 watts for the UltraSPARC–IIi 270 MHz CPU
θjc
Junction-to-case thermal resistance of the
package
This value is approximately 0.5
°C/W
θcs
Case-to-heatsink thermal resistance
This value is approximately 0.1
°C/W when
good thermal grease contact is made between
the package and the heatsink.
θsa
Heatsink-to-air thermal resistance
This value is dependent on the heatsink
design, the airow direction, and the airow
velocity. (see Table 2)
Airow
Free Stream Airow
Unchanneled airow velocity approaching
the heatsink.
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