參數(shù)資料
型號(hào): SDC2800DUT3D
廠(chǎng)商: ADVANCED MICRO DEVICES INC
元件分類(lèi): 微控制器/微處理器
英文描述: 2000 MHz, MICROPROCESSOR, CPGA453
封裝: OPGA-453
文件頁(yè)數(shù): 96/102頁(yè)
文件大小: 3049K
代理商: SDC2800DUT3D
Appendix A - Thermal Diode Calculations
81
31994A—1August 2004
AMD Sempron Processor Model 10 with 256K L2 Cache Data Sheet
The formulas in Equation (3) and Equation (4) can be used to
calculate the temperature offset for temperature sensors that
do not employ series resistance cancellation. The result is
added to the value measured by the temperature sensor.
Contact the vendor of the temperature sensor being used for
the value of nf,TS. Refer to the document, On-Die Thermal Diode
Characterization, order# 25443, for further details.
Equation (3) shows the equation for calculating the lumped
ideality factor (nf, lumped) in sensors that do not employ series
resistance cancellation.
Equation (4) shows the equation for calculating temperature
offset (Toffset) in sensors that do not employ series resistance
cancellation.
Equation (5) is the temperature offset for temperature sensors
that utilize series resistance cancellation. Add the result to the
value measured by the temperature sensor. Note that the value
of nf,TS in Equation (5) may not equal the value used in
(3)
n
f lumped
,
n
f actual
,
=
R
T
I
high
I
low
()
k
q
--- T
die spec
,
273.15
+
()
I
high
I
low
--------
ln
----------------------------------------------------------------------
+
(4)
T
offs e t
T
die spec
,
273.15
+
()
=
1 nf lumped
,
n
fTS
,
---------------
(5)
T
offs e t
T
die spec
,
273.15
+
()
=
1
n
f
actual
,
n
fTS
,
---------------
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