參數(shù)資料
型號: SDC2800DUT3D
廠商: ADVANCED MICRO DEVICES INC
元件分類: 微控制器/微處理器
英文描述: 2000 MHz, MICROPROCESSOR, CPGA453
封裝: OPGA-453
文件頁數(shù): 46/102頁
文件大?。?/td> 3049K
代理商: SDC2800DUT3D
36
Electrical Data
Chapter 7
AMD Sempron Processor Model 10 with 256K L2 Cache Data Sheet
31994A—1August 2004
Thermal Protection
Characterization
The following section describes parameters relating to thermal
protection. The implementation of thermal control circuitry to
control processor temperature is left to the manufacturer to
determine how to implement.
Thermal limits in motherboard design are necessary to protect
the processor from thermal damage. TSHUTDOWN is the
temperature for thermal protection circuitry to initiate
shutdown of the processor. TSD_DELAY is the maximum time
allowed from the detection of the over-temperature condition to
processor shutdown to prevent thermal damage to the
processor.
Systems that do not implement thermal protection circuitry or
that do not react within the time specified by TSD_DELAY can
cause thermal damage to the processor during the unlikely
events of fan failure or powering up the processor without a
heat-sink. The processor relies on thermal circuitry on the
motherboard to turn off the regulated core voltage to the
processor in response to a thermal shutdown event.
Thermal protection circuitry reference designs and thermal
solution guidelines are found in the following documents:
AMD Athlon Processor-Based Motherboard Design Guide, order#
24363
AMD Thermal, Mechanical, and Chassis Cooling Design Guide,
order# 23794
See http://www.amd.com for more information about thermal
solutions.
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