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參數(shù)資料
| 型號(hào)： | RF3133 |
| 廠商： | RF Monolithics, Inc. |
| 英文描述： | QUAD-BAND GSM850/GSM/DCS/PCS POWER AMP MODULE |
| 中文描述： | 四頻GSM850/GSM/DCS/PCS功率放大器模塊 |
| 文件頁(yè)數(shù)： | 14/16頁(yè) |
| 文件大小： | 196K |
| 代理商： | RF3133 |
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2-472
RF3133
Rev A4 030527
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is
3
μ
inch to 8
μ
inch Gold over 180
μ
inch Nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land and Solder Mask Pattern
Metal Land Pattern
0.00
0
1
5
2
5
0.80 (mm)
3.70 (mm)
1.50 (mm)
0.70 (mm)
3.00 (mm)
4.50 (mm) Typ.
6.00 (mm)
7.50 (mm)
9.00 (mm) Typ.
8.30 (mm)
5.30 (mm)
8.20 (mm)
0
A = 0.80 (mm) Sq. Typ.
B = 1.00 x 0.80 (mm) Typ.
Pin 1
A
B
A
A
A
A
A
A
A
A
B
B
Solder Mask Pattern
0
0.00
1
3
4
5
2
1.50 (mm) Typ.
3.00 (mm) Typ.
4.50 (mm) Typ.
6.00 (mm) Typ.
7.50 (mm) Typ.
9.00 (mm) Typ.
4.50 (mm)
Pin 1
0.05 (mm) Typ.
9.05 (mm) Typ.
B
C
D
E
E
E
E
D
D
A
B
B
B
C
C
C
C
A
A
A
A
A
A
A
A
F
A = 1.00 (mm) Sq. Typ.
B = 0.90 x 0.80 (mm) Typ.
C = 0.80 (mm) Sq. Typ.
D = 1.00 x 1.20 (mm) Typ.
E = 0.80 x 1.10 (mm) Typ.
F = 7.00 x 2.50 (mm) Typ.
Figure 1. PCB Metal Land and Solder Mask Pattern (Top View)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RF3133_05 | 制造商:RFMD 制造商全稱(chēng):RF Micro Devices 功能描述:QUAD-BAND GSM850/GSM/DCS/PCS POWER AMP MODULE |
| RF3133PCBA | 制造商:RFM 制造商全稱(chēng):RF Monolithics, Inc 功能描述:QUAD-BAND GSM850/GSM/DCS/PCS POWER AMP MODULE |
| RF3133PCBA-41X | 制造商:RFMD 制造商全稱(chēng):RF Micro Devices 功能描述:QUAD-BAND GSM850/GSM/DCS/PCS POWER AMP MODULE |
| RF313-5 | 功能描述:高頻/射頻繼電器 5V DC-6GHz .15W hi sensitivity RoHS:否 制造商:Omron Electronics 觸點(diǎn)形式:2 Form C (DPDT-BM) 觸點(diǎn)電流額定值: 線(xiàn)圈電壓:5 VDC 線(xiàn)圈類(lèi)型:Non-Latching 頻率: 功耗:100 mW 端接類(lèi)型:Solder Terminal 絕緣:20 dB to 30 dB at 1 GHz 介入損耗:0.2 dB at 1 GHz |
| RF313-5/G | 制造商:Teledyne Relays 功能描述: |
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