參數(shù)資料
型號(hào)： RD28F3208C3T90
廠商： INTEL CORP
元件分類： 存儲(chǔ)器
英文描述： 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
中文描述： SPECIALTY MEMORY CIRCUIT, PBGA66
封裝： 8 X 10 MM, 1.20 MM HEIGHT, SCSP-66
文件頁(yè)數(shù)： 45/70頁(yè)
文件大?。?/td> 1223K
代理商： RD28F3208C3T90
3VoltIntel
Advanced+BootBlockFlashMemoryStacked-CSPFamily
Datasheet
45
7.4.1
SRAMOperationduringFlash“Busy”
ThisfunctionalityprovidestheabilitytouseboththeflashandtheSRAM“atthesametime”
withinasystem,similartotheoperationoftwodeviceswithseparatefootprints.Thisoperationcan
beachievedbyfollowingtheappropriatetimingconstraintswithinasystem.
7.4.2
SimultaneousBusOperations
OperationsthatrequireboththeSRAMandFlashtobeinactivemodearedisallowed.Anexample
ofthesecaseswouldincludesimultaneousreadsonboththeflashandSRAM,whichwouldresult
incontentionforthedatabus.Finally,areadofonedevicewhileattemptingtowritetotheother
(similartotheconditionsofdirectmemoryaccess(DMA)operation)arealsonotwithinthe
recommendedoperatingconditions.Basically,onlyonememorycandrivetheoutputsoutthe
deviceatonegivenpointintime.
7.5
PrintedCircuitBoardNotes
TheIntelStacked-CSPwillsavesignificantspaceonyourPCBbycombiningtwochipsintoone
BGAstylepackage.IntelStacked-CSPhasa0.8mmpitchthatcanberoutedonyourPrinted
CircuitBoardwithconventionaldesignrules.Tracewidthsof0.127mm(0.005inches)aretypical.
Unusedballsinthecenterofthepackagearenotpopulatedtofurtherincreasetheroutingoptions.
StandardsurfacemountprocessandequipmentcanbeusedfortheIntelStacked-CSP.
NOTE:
TopView
7.6
SystemDesignNotesSummary
TheAdvanced+BootBlockStacked-CSPallowshigherlevelsofmemorycomponentintegration.
Differentpowersupplyconfigurationscanbeusedwithinthesystemtoachievedifferent
objectives.Atleastthreedifferent0.1μfcapacitorsshouldbeusedtodecouplethedeviceswithina
system.SRAMreadsorwritesduringaflashprogramorerasearesupportedoperations.Standard
printedcircuitboardtechnologycanbeused.
Figure14.StandardPCBDesignRulesCanbeUsedwithStacked-CSPDevice
LandPadDiameter:0.35mm(0.0138in)
SolderMaskOpening:0.50mm(0.0198in)
TraceWidth:0.127mm(0.005in)
TraceSpaces:0.160mm(0.00625in)
ViaCapturePad:0.51mm(0.020in)
ViaDrillSize:0.25mm(0.010in)
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