參數(shù)資料
型號: PNX8510
廠商: NXP Semiconductors N.V.
英文描述: Analog companion chip
中文描述: 模擬伴隨芯片
文件頁數(shù): 87/92頁
文件大?。?/td> 3064K
代理商: PNX8510
Philips Semiconductors
PNX8510/11
Analog companion chip
Product data
Rev. 04 – 12 January 2004
87 of 92
9397 750 12612
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[1]
Full scale output voltage is directly proportional to DC voltage at VREF pin (VDDA/2) and maximum digital signal level at low
frequencies. Relation: Vout(rms) =
α
* 1.645 * vref/1.41,
α
= maximum digital input level at low frequencies.
Common mode output voltage equals VREF=VDDA/2/
[2]
13. Package outline
Fig 35. HTQFP package outline.
UNIT
A
max.
A1
A2
A3
bp
HD
HE
Lp
ZD
(1)
ZE
(1)
c
e
L
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
1.2
0.15
0.05
1.05
0.95
0.25
0.27
0.17
0.20
0.09
14.1
13.9
0.5
16.15
15.85
1.15
0.85
7
°
0
°
0.08
0.08
0.2
1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT638-1
01-03-30
03-04-07
D
(1)
E
(1)
14.1
13.9
16.15
15.85
Dh
Eh
7.1
6.1
7.1
6.1
1.15
0.85
bp
bp
e
θ
E
A1
A
Lp
L
detail X
(A3)
B
25
HD
HE
A2
v
M
B
D
ZD
A
c
ZE
e
v
M
A
X
1
100
76
75
51
50
26
y
pin 1 index
w
M
w
M
0
10 mm
scale
HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads;
body 14 x 14 x 1 mm; exposed die pad
SOT638-1
Dh
Eh
exposed die pad side
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