
2006 Microchip Technology Inc.
Preliminary
DS41268B-page 59
PIC12F510/16F506
TABLE 10-2:
CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR –
PIC12F510/16F506
(2)
10.2.3
EXTERNAL CRYSTAL OSCILLATOR
CIRCUIT
Either a prepackaged oscillator or a simple oscillator
circuit with TTL gates can be used as an external
crystal oscillator circuit. Prepackaged oscillators
provide a wide operating range and better stability. A
well-designed crystal oscillator will provide good perfor-
mance with TTL gates. Two types of crystal oscillator
circuits can be used: one with parallel resonance or one
with series resonance.
Figure 10-3 shows implementation of a parallel reso-
nant oscillator circuit. The circuit is designed to use the
fundamental frequency of the crystal. The 74AS04
inverter performs the 180-degree phase shift that a
parallel oscillator requires. The 4.7 k
Ω
resistor provides
the negative feedback for stability. The 10 k
Ω
potenti-
ometers bias the 74AS04 in the linear region. This
circuit could be used for external oscillator designs.
FIGURE 10-3:
EXTERNAL PARALLEL
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
Figure 10-4 shows a series resonant oscillator circuit.
This circuit is also designed to use the fundamental
frequency of the crystal. The inverter performs a 180-
degree phase shift in a series resonant oscillator
circuit. The 330
Ω
resistors provide the negative
feedback to bias the inverters in their linear region.
FIGURE 10-4:
EXTERNAL SERIES
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
10.2.4
EXTERNAL RC OSCILLATOR
For timing insensitive applications, the EXTRC device
option offers additional cost savings. The EXTRC oscil-
lator frequency is a function of the supply voltage, the
resistor (R
EXT
) and capacitor (C
EXT
) values, and the
operating temperature. In addition to this, the oscillator
frequency will vary from unit-to-unit due to normal pro-
cess parameter variation. Furthermore, the difference
in lead frame capacitance between package types will
also affect the oscillation frequency, especially for low
C
EXT
values. The user also needs to take into account
variation due to tolerance of external R and C
components used.
Figure 10-5 shows how the R/C combination is
connected to the PIC12F510/16F506 devices. For
R
EXT
values below 5.0 k
Ω
, the oscillator operation may
become unstable or stop completely. For very high
R
EXT
values (e.g., 1 M
Ω
), the oscillator becomes
sensitive to noise, humidity and leakage. Thus, we
recommend keeping R
EXT
between 5.0 k
Ω
and
100 k
Ω
.
Osc.
Type
Resonator
Freq.
Cap.Range
C1
Cap. Range
C2
LP
XT
32 kHz
(1)
200 kHz
1 MHz
4 MHz
20 MHz
For V
DD
> 4.5V, C1 = C2
≈
30 pF is
recommended.
These values are for design guidance
only. Rs may be required to avoid over-
driving crystals beyond the drive level
specification. Since each crystal has its
own characteristics, the user should con-
sult the crystal manufacturer for appropri-
ate values of external components.
PIC16F506 only.
15 pF
47-68 pF
15 pF
15 pF
15-47 pF
15 pF
47-68 pF
15 pF
15 pF
15-47 pF
HS
(3)
Note 1:
2:
3:
20 pF
+5V
20 pF
10k
4.7k
10k
74AS04
XTAL
10k
74AS04
CLKIN
To Other
Devices
PIC12F510
PIC16F506
330
74AS04
74AS04
CLKIN
PIC12F510
PIC16F506
To Other
Devices
XTAL
330
74AS04
0.1 mF