參數(shù)資料
型號: PHB130N03LT
廠商: NXP SEMICONDUCTORS
元件分類: JFETs
英文描述: TrenchMOS transistor Logic level FET
中文描述: 75 A, 30 V, 0.006 ohm, N-CHANNEL, Si, POWER, MOSFET
封裝: PLASTIC, SOT-404, 3 PIN
文件頁數(shù): 2/8頁
文件大?。?/td> 63K
代理商: PHB130N03LT
Philips Semiconductors
Product specification
TrenchMOS
transistor
Logic level FET
PHB130N03LT
ESD LIMITING VALUE
SYMBOL
V
C
PARAMETER
Electrostatic discharge capacitor
voltage, all pins
CONDITIONS
Human body model
(100 pF, 1.5 k
)
MIN.
-
MAX.
2
UNIT
kV
STATIC CHARACTERISTICS
T
j
= 25C unless otherwise specified
SYMBOL
PARAMETER
V
(BR)DSS
Drain-source breakdown
voltage
V
GS(TO)
Gate threshold voltage
CONDITIONS
V
GS
= 0 V; I
D
= 0.25 mA;
MIN.
30
27
1.0
0.5
-
-
-
-
-
10
TYP.
-
-
1.5
-
-
0.05
-
0.02
-
-
MAX.
-
-
2.0
-
2.3
10
500
1
10
-
UNIT
V
V
V
V
V
μ
A
μ
A
μ
A
μ
A
V
T
j
= -55C
V
DS
= V
GS
; I
D
= 1 mA
T
j
= 175C
T
j
= -55C
I
DSS
Zero gate voltage drain current
V
DS
= 30 V; V
GS
= 0 V;
T
j
= 175C
I
GSS
Gate source leakage current
V
GS
=
±
5 V; V
DS
= 0 V
T
j
= 175C
±
V
(BR)GSS
Gate-source breakdown
voltage
Drain-source on-state
resistance
I
G
=
±
1 mA;
R
DS(ON)
V
GS
= 5 V; I
D
= 25 A
-
-
5
-
6
11
m
m
T
j
= 175C
DYNAMIC CHARACTERISTICS
T
mb
= 25C unless otherwise specified
SYMBOL
PARAMETER
g
fs
Forward transconductance
Q
g(tot)
Total gate charge
Q
gs
Gate-source charge
Q
gd
Gate-drain (Miller) charge
C
iss
Input capacitance
C
oss
Output capacitance
C
rss
Feedback capacitance
t
d on
Turn-on delay time
t
r
Turn-on rise time
t
d off
Turn-off delay time
t
f
Turn-off fall time
L
d
Internal drain inductance
L
d
Internal drain inductance
CONDITIONS
V
DS
= 25 V; I
D
= 25 A
I
D
= 75 A; V
DD
= 24 V; V
GS
= 5 V
MIN.
20
-
-
-
-
-
-
-
-
-
-
-
-
TYP.
40
92
10
36
5000
1150
500
45
120
225
100
3.5
4.5
MAX.
-
-
-
-
-
-
-
60
170
300
135
-
-
UNIT
S
nC
nC
nC
pF
pF
pF
ns
ns
ns
ns
nH
nH
V
GS
= 0 V; V
DS
= 25 V; f = 1 MHz
V
DD
= 15 V; I
D
= 25 A;
V
= 5 V; R
= 5
Resistive load
Measured from tab to centre of die
Measured from drain lead solder
point to centre of die
Measured from source lead solder
point to source bond pad
L
s
Internal source inductance
-
7.5
-
nH
December 1997
2
Rev 1.200
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