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參數(shù)資料
| 型號： | PCX7447AVGH1000NB |
| 廠商： | Atmel |
| 文件頁數(shù)： | 7/52頁 |
| 文件大小： | 0K |
| 描述： | IC MPU 32BIT 1000MHZ 360CBGA |
| 標準包裝： | 44 |
| 處理器類型： | PowerPC 32-位 RISC |
| 速度： | 1.0GHz |
| 電壓： | 1.1V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 360-CBBGA 裸露焊盤 |
| 供應商設備封裝： | 360-CBGA（25x25） |
| 包裝： | 托盤 |
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15
0833E–HIREL–01/07
e2v semiconductors SAS 2007
PC7447A
For this example, a Rθsa value of 2.1°C/W or less is required to maintain the die junction temperature
below the maximum value of Table 6-2 on page 10.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common fig-
ure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal manage-
ment because no single parameter can adequately describe three-dimensional heat flow. The final die-
junction operating temperature is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component's power consumption, a
number of factors affect the final operating die-junction temperature – airflow, board population (local
heat flux of adjacent components), heat sink efficiency, heat sink attach, heat sink placement, next-level
interconnect technology, system air temperature rise, altitude, and so on.
Due to the complexity and variety of system-level boundary conditions for today's microelectronic equip-
ment, the combined effects of the heat transfer mechanisms (radiation, convection, and conduction) may
vary widely. For these reasons, we recommend using conjugate heat transfer models for the board, as
well as system-level designs.
For system thermal modeling, the PC7447A thermal model is shown in Figure 6-5 on page 16. Four vol-
umes represent this device. Two of the volumes, solder ball-air and substrate, are modeled using the
package outline size of the package. The other two, die, and bump-underfill, have the same size as the
die. The silicon die should be modeled 9.5 × 9.5 × 0.7 mm with the heat source applied as a uniform
source at the bottom of the volume. The bump and underfill layer is modeled as 7.3 × 9.3 × 0.7 mm (or
as a collapsed volume) with orthotropic material properties: 0.6 W/(m × K) in the xy-plane and 1.9 W/(m
× K) in the direction of the z-axis. The substrate volume is 25 × 25 × 1.2 mm, and has 8.1 W/(m × K) iso-
tropic conductivity in the xy-plane and 4 W/(m × K) in the direction of the z-axis. The solder ball and air
layer are modeled with the same horizontal dimensions as the substrate and are 0.6 mm thick. They can
also be modeled as a collapsed volume using orthotropic material properties: 0.034 W/(m × K) in the xy-
plane direction and 3.8 W/(m × K) in the direction of the z-axis.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCX7447AVGH1167NB | 功能描述:IC MPU 32BIT 1167MHZ 360CBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標準包裝:60 系列:SCC 處理器類型:Z380 特點:全靜電 Z380 CPU 速度:20MHz 電壓:5V 安裝類型:表面貼裝 封裝/外殼:144-LQFP 供應商設備封裝:144-LQFP 包裝:托盤 |
| PCX7448MGH1000NC | 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.09UM 1GHZ 1.5V/1.8V/2.5V 360HITCE CBGA - Trays |
| PCX7448MGH1250NC | 制造商:e2v technologies 功能描述:PCX7448MGH1250NC - Trays |
| PCX7448VGH1000NC | 制造商:e2v technologies 功能描述:PCX7448VGH1000NC - Trays |
| PCX7448VGH1250NC | 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.09UM 1.25GHZ 1.5V/1.8V/2.5V 360HITCE CBGA - Trays |
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