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參數(shù)資料
型號: PCX7447AVGH1000NB
廠商: Atmel
文件頁數(shù): 26/52頁
文件大?。?/td> 0K
描述: IC MPU 32BIT 1000MHZ 360CBGA
標(biāo)準(zhǔn)包裝: 44
處理器類型: PowerPC 32-位 RISC
速度: 1.0GHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 360-CBBGA 裸露焊盤
供應(yīng)商設(shè)備封裝: 360-CBGA(25x25)
包裝: 托盤
32
0833E–HIREL–01/07
PC7447A
e2v semiconductors SAS 2007
Figure 9-8.
Test Access Port Timing Diagram
Note:
VM = Midpoint Voltage (OV
DD/2)
10. Preparation for Delivery
10.1
Handling
MOS devices must be handled with certain precautions to avoid damage due to accumulation of static
charge. Input protection devices have been designed in the chip to minimize the effect of static buildup.
However, the following handling practices are recommended:
Devices should be handled on benches with conductive and grounded surfaces
Ground test equipment, tools and operator
Do not handle devices by the leads
Store devices in conductive foam or carriers
Avoid use of plastic, rubber or silk in MOS areas
Maintain relative humidity above 50% if practical
11. Package Mechanical Data
The following sections provide the package parameters and mechanical dimensions for the HITCE
package.
11.1
Package Parameters for the PC7447A, 360 HITCE
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead
high coefficient of the thermal expansion ceramic ball grid array (HITCE).
Package outline
25 mm × 25 mm
Interconnects
360 (19 × 19 ball array - 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.72 mm
Maximum module height
3.24 mm
Ball diameter
0.89 mm (35 mil)
tJLOX
Input Data
Valid
tIVJH
tIXJH
tJLOV
tJLOZ
Output Data Valid
VM
TCK
TDI, TMS
TDO
VM
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