-
您好,
买卖IC网欢迎您。
-
請(qǐng)登錄
-
免費(fèi)注冊(cè)
-
-
-
-
[北京]010-87982920
-
[深圳]0755-82701186
-
- 您現(xiàn)在的位置:買(mǎi)賣(mài)IC網(wǎng) > PDF目錄382380 > PCD5008H (NXP SEMICONDUCTORS) FLEX Pager Decoder PDF資料下載
參數(shù)資料
型號(hào):
PCD5008H
廠商:
NXP SEMICONDUCTORS
元件分類(lèi):
尋呼電路
英文描述:
FLEX Pager Decoder
中文描述:
TELECOM, PAGING DECODER, PQFP32
封裝:
7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, SOT-358-1, LQFP-32
文件頁(yè)數(shù):
61/64頁(yè)
文件大?。?/td>
341K
代理商:
PCD5008H
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)當(dāng)前第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)
1998 Jun 1761Philips SemiconductorsProduct specificationFLEX Pager DecoderPCD500817 SOLDERING17.1IntroductionThere is no soldering method that is ideal for all ICpackages. Wave soldering is often preferred whenthrough-hole and surface mounted components are mixedon one printed-circuit board. However, wave soldering isnot always suitable for surface mounted ICs, or forprinted-circuits with high population densities. In thesesituations reflow soldering is often used.This text gives a very brief insight to a complex technology.A more in-depth account of soldering ICs can be found inour “Data Handbook IC26; Integrated Circuit Packages”(order code 9398 652 90011).17.2Reflow solderingReflow soldering techniques are suitable for all LQFPpackages.Reflow soldering requires solder paste (a suspension offine solder particles, flux and binding agent) to be appliedto the printed-circuit board by screen printing, stencilling orpressure-syringe dispensing before package placement.Several methods exist for reflowing; for example,infrared/convection heating in a conveyor type oven.Throughput times (preheating, soldering and cooling) varybetween 50 and 300 seconds depending on heatingmethod. Typical reflow peak temperatures range from215 to 250 °C.17.3Wave solderingWave soldering is not recommended for LQFP packages.This is because of the likelihood of solder bridging due toclosely-spaced leads and the possibility of incompletesolder penetration in multi-lead devices.CAUTIONWave soldering is NOT applicable for all LQFPpackages with a pitch (e) equal or less than 0.5 mm.If wave soldering cannot be avoided, for LQFPpackages with a pitch (e) larger than 0.5 mm, thefollowing conditions must be observed: A double-wave (a turbulent wave with high upwardpressure followed by a smooth laminar wave)soldering technique should be used. The footprint must be at an angle of 45° to the boarddirection and must incorporate solder thievesdownstream and at the side corners.During placement and before soldering, the package mustbe fixed with a droplet of adhesive. The adhesive can beapplied by screen printing, pin transfer or syringedispensing. The package can be soldered after theadhesive is cured.Maximum permissible solder temperature is 260 °C, andmaximum duration of package immersion in solder is10 seconds, if cooled to less than 150 °C within6 seconds. Typical dwell time is 4 seconds at 250 °C.A mildly-activated flux will eliminate the need for removalof corrosive residues in most applications.17.4Repairing soldered jointsFix the component by first soldering two diagonally-opposite end leads. Use only a low voltage soldering iron(less than 24 V) applied to the flat part of the lead. Contacttime must be limited to 10 seconds at up to 300 °C. Whenusing a dedicated tool, all other leads can be soldered inone operation within 2 to 5 seconds between270 and 320 °C.
相關(guān)PDF資料
PDF描述
PCD5013
FLEX roaming decoder II
PCD5013H
FLEX roaming decoder II
PCD5032
ADPCM CODEC for digital cordless telephones
PCD5032H
ADPCM CODEC for digital cordless telephones
PCD5032T
ADPCM CODEC for digital cordless telephones
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCD5008HBD-T
制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:Telecommunication Decoder
PCD5013
制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:FLEX roaming decoder II
PCD5013H
制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:FLEX roaming decoder II
PCD5032
制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:ADPCM CODEC for digital cordless telephones
PCD5032B
制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:Linear CODEC
發(fā)布緊急采購(gòu),3分鐘左右您將得到回復(fù)。
- VIP會(huì)員服務(wù) |
- 廣告服務(wù) |
- 付款方式 |
- 聯(lián)系我們 |
- 招聘銷(xiāo)售 |
- 免責(zé)條款 |
- 網(wǎng)站地圖
-
我 - 采购
- 搜索
- 会员
-
-