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參數(shù)資料
| 型號(hào)： | P4C169-55LMB |
| 廠商： | PYRAMID SEMICONDUCTOR CORP |
| 元件分類： | SRAM |
| 英文描述： | 4K X 4 STANDARD SRAM, 55 ns, CQCC20 |
| 封裝： | 0.290 X 0.430 INCH, CERAMIC, LCC-20 |
| 文件頁數(shù)： | 1/14頁 |
| 文件大小： | 263K |
| 代理商： | P4C169-55LMB |
1
P4C168, P4C169, P4C170
ULTRA HIGH SPEED 4K x 4
STATIC CMOS RAMS
DESCRIPTION
The P4C168, P4C169 and P4C170 are a family of
16,384-bit ultra high-speed static RAMs organized as 4K
x 4. All three devices have common input/output ports.The
P4C168 enters the standby mode when the chip enable
(CE) control goes HIGH; with CMOS input levels, power
consumption is only 83mW in this mode. Both the P4C169
and the P4C170 offer a fast chip select access time that
is only 67% of the address access time. In addition, the
P4C170 includes an output enable (OE) control to elimi-
nate data bus contention. The RAMs operate from a
single 5V ± 10% tolerance power supply.
FEATURES
Full CMOS, 6T Cell
High Speed (Equal Access and Cycle Times)
– 12/15/20/25/35ns (Commercial)
– 20/25/35/45/55/70ns (P4C168 Military)
Low Power Operation (Commercial)
– 715 mW Active
– 193 mW Standby (TTL Input) P4C168
– 83 mW Standby (CMOS Input) P4C168
Single 5V±10% Power Supply
Fully TTL Compatible, Common I/O Ports
Three Options
– P4C168 Low Power Standby Mode
– P4C169 Fast Chip Select Control
– P4C170 Fast Chip Select, Output Enable
Controls
Standard Pinout (JEDEC Approved)
– P4C168: 20-pin DIP, SOJ, LCC, SOIC,
CERPACK, and Flat Pack
– P4C169: 20-pin DIP and SOIC
– P4C170: 22-pin DIP
Access times as fast as 12 nanoseconds are available,
permitting greatly enhanced system operating speeds.
CMOS is used to reduce power consumption to a low 715
mW active, 193 mW standby.
The P4C168 and P4C169 are available in 20-pin (P4C170
in 22-pin) 300 mil DIP packages providing excellent
board level densities. The P4C168 is also available in 20-
pin 300 mil SOIC, SOJ, CERPACK, and Flat Pack
packages.
The P4C169 is also available in a 20-pin 300 mil SOIC
package.
PIN CONFIGURATIONS
FUNCTIONAL BLOCK DIAGRAM
P4C168
P4C169
DIP (P2, C6, D2)
DIP (P2)
SOIC (S2)
SOJ (J2)
CERPACK (F2)
SOLDER SEAL FLAT PACK (FS-2)
P4C170
DIP (P3)
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