參數(shù)資料
型號： ORT8850L-2BM680I
廠商： Lattice Semiconductor Corporation
文件頁數(shù)： 4/105頁
文件大?。?/td> 0K
描述： IC FPSC TRANSCEIVER 8CH 680-BGA
產(chǎn)品變化通告： Product Discontinuation 01/Aug/2011
標(biāo)準(zhǔn)包裝： 24
系列： *
Lattice Semiconductor
ORCA ORT8850 Data Sheet
101
FPSC Maximum Junction Temperature
Once the power dissipated by the FPSC has been determined, the maximum junction temperature of the FPSC
can be found. This is needed to determine if speed derating of the device from the 85 °C junction temperature used
in all of the delay tables is needed. Using the maximum ambient temperature, TAmax, and the power dissipated by
the device, Q (expressed in °C), the maximum junction temperature is approximated by:
TJmax = TAmax + (Q
θ
JA)
Table 37 lists the thermal characteristics for the package used with the
ORCA ORT8850 Series of FPSCs.
Package Thermal Characteristics
Table 37. ORCA ORT8850 Plastic Package Thermal Guidelines
Heat Sink Information
The estimated worst-case power requirements for the ORT8850 are in the 4 W to 5 W range. Consequently, for
most applications an external heat sink will be required. The following table lists, in alphabetical order, heat sink
vendors who advertise heat sinks aimed at the BGA market.
Table 38. Heat Sink Vendors
Package Coplanarity
The coplanarity limits of the Lattice packages are as follows:
PBGAM: 8.0 mils
Package
Θ
ΘJA (°C/W)
Maximum Power (W)
0 fpm
200 fpm
500 fpm
T = 70 °C Max, TJ = 125 °C Max, 0 fpm
680-Pin PBGAM*
13.4
11.5
10.5
4.10
*
The 680-Pin PBGAM package includes 2 oz. copper plates.
Vendor
Location
Phone
Aavid Thermalloy
Concord, NH
(603) 224-9988
Chip Coolers (Tyco Electronics)
Harrisburg, PA
(800) 468-2023
IERC (CTS Corp.)
Burbank, CA
(818) 842-7277
R-Theta
Buffalo, NY
(800) 388-5428
Sanyo Denki
Torrance, CA
(310) 783-5400
Wakeeld Thermal Solutions
Pelham, NH
(603) 635-2800
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ORT8850L-2BMN680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 4992 LUT 278 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT8850L-2BMN680I 功能描述:FPGA - 現(xiàn)場可編程門陣列 4992 LUT 278 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT8850L-3BM680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 4992 LUT 278 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT8850L-3BMN680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 4992 LUT 278 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT9303 制造商:BOT 制造商全稱:Bedford Opto Technology Ltd. 功能描述:3 ELEMENT PCB MOUNT 1.8mm LED ARRAY
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