參數(shù)資料
型號(hào)： ORLI10G-3BM416
廠商： LATTICE SEMICONDUCTOR CORP
元件分類： FPGA
英文描述： FPGA, 1296 CLBS, 380000 GATES, PBGA416
封裝： PLASTIC, BGA-416
文件頁(yè)數(shù)： 12/76頁(yè)
文件大?。?/td> 1222K
代理商： ORLI10G-3BM416
Table of Contents
Contents
Page
Contents
Page
2
Lattice Semiconductor
Data Sheet
January 15, 2002
and ORLI12G Gbits/s Line Interface FPSC
ORCA ORLI10G Quad 2.5 Gbits/s, 10 Gbits/s
Introduction..................................................................1
Embedded Function Features .....................................4
Intellectual Property Features......................................4
Programmable Features..............................................4
Programmable Logic System Features .......................6
Description...................................................................7
FPSC Definition .........................................................7
FPSC Overview .........................................................7
FPSC Gate Counting ................................................7
FPGA/Embedded Core Interface ..............................7
ORCA Foundry Development System ......................7
FPSC Design Kit .......................................................8
FPGA Logic Overview ...............................................8
PLC Logic ..................................................................8
Programmable I/O .....................................................9
Routing ......................................................................9
System-Level Features..............................................10
Microprocessor Interface ...........................................10
System Bus .............................................................10
Phase-Locked Loops ..............................................10
Embedded Block RAM ............................................10
Configuration ...........................................................11
Additional Information .............................................11
ORLI10G Overview ...................................................11
Device Layout .........................................................11
10G Mode ...............................................................11
2.5G Mode ..............................................................12
Receive Path Details .................................................15
Line Interface ..........................................................15
DeMUX ....................................................................15
Onboard Receive PLLs ...........................................15
Transmit Path Details ................................................17
MUX ........................................................................17
Onboard Transmit PLLs ..........................................17
Line Interface ..........................................................17
ORLI10G Demultiplexer (Rx) Detail ..........................19
ORLI10G Multiplexer (Tx) Detail ...............................25
ORLI10G Embedded PLLs........................................31
ORLI10G Embedded Programmable PLLs
Specifications............................................................32
ORLI10G Reset Requirements..................................32
Line Interface Circuit Specifications ..........................33
Power Supply Decoupling LC Circuit ......................33
XGMII ORCA 4E Receive Analysis ...........................34
XGMII Considerations .............................................34
Absolute Maximum Ratings.......................................35
Recommended Operating Conditions .......................35
Embedded Core LVDS I/O ....................................... 36
LVDS Receiver Buffer Requirements ..................... 37
Timing Characteristics .............................................. 38
Receive Input Data Interface .................................. 38
Transmit STS-48/STS-192 (2.5G/10G) Data
Outputs ................................................................. 39
Input/Output Buffer Measurement Conditions
(Non-LVDS Buffer)................................................... 40
LVDS Buffer Characteristics..................................... 41
Termination Resistor .............................................. 41
LVDS Driver Buffer Capabilities ............................. 41
Pin Information ......................................................... 42
Pin Descriptions ..................................................... 42
Package Pinouts .................................................... 48
Package Thermal Characteristics Summary ............ 68
ΘJA ........................................................................ 68
ψJC ........................................................................ 68
ΘJC ........................................................................ 68
ΘJB ........................................................................ 68
FPSC Maximum Junction Temperature ................. 68
Package Thermal Characteristics............................. 69
Heat Sink Vendors for BGA Packages ..................... 69
Package Coplanarity ................................................ 69
Package Parasitics ................................................... 70
Package Outline Diagrams....................................... 71
Terms and Definitions ............................................ 71
416-Pin PBGAM ..................................................... 72
680-Pin PBGAM ..................................................... 73
Hardware Ordering Information ................................ 74
Software Ordering Information ................................. 74
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相關(guān)代理商/技術(shù)參數(shù)
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ORLI10G-3BM680C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORLI10G-3BMN680C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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ORM0200-03600 N-70 制造商:SMC Corporation of America 功能描述:O-RING
ORM120A110 制造商:Ssac 功能描述:
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