參數(shù)資料
型號： ORLI10G-2BM416
廠商： LATTICE SEMICONDUCTOR CORP
元件分類： FPGA
英文描述： FPGA, 1296 CLBS, 380000 GATES, PBGA416
封裝： PLASTIC, BGA-416
文件頁數(shù)： 29/76頁
文件大小： 1222K
代理商： ORLI10G-2BM416
Lattice Semiconductor
35
Data Sheet
January 15, 2002
and ORLI12G Gbits/s Line Interface FPSC
ORCA ORLI10G Quad 2.5 Gbits/s, 10 Gbits/s
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of this data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
The ORCA Series 4 FPSCs include circuitry designed to protect the chips from damaging substrate injection cur-
rents and to prevent accumulations of static charge. Nevertheless, conventional precautions should be observed
during storage, handling, and use to avoid exposure to excessive electrical stress.
Table 4. Absolute Maximum Ratings
Recommended Operating Conditions
Table 5. Recommended Operating Conditions
Notes:
The maximum recommended junction temperature (TJ) during operation is 125 C.
Timing parameters in this data sheet and ORCA Foundry are characterized under tighter voltage and temperature conditions than the recom-
mended operating conditions in this table.
The internal PLLs operate from the VDD33 and VDD33_A power supplies. These power supplies should be well isolated from all other power
supplies on the board for proper operation.
Parameter
Symbol
Min
Max
Unit
Storage Temperature
TSTG
–65
150
C
Power Supply Voltage with Respect to
Ground
VDD33
–0.3
4.2
V
VDDIO
–0.3
4.2
V
VDD33, VDD33_A
–0.3
2.0
V
VDD15
–0.3
2.0
V
Input Signal with Respect to Ground
VIN
–0.3
VDDIO + 0.3
V
Signal Applied to High-impedance Output
—
–0.3
VDDIO + 0.3
V
Maximum Package Body Temperature
—
220
C
Parameter
Symbol
Min
Max
Unit
Power Supply Voltage with Respect to
Ground
VDD33
3.0
3.6
V
VDDIO
1.4
3.6
V
VDD33, VDD33_A
3.0
3.6
V
VDD15
1.4
1.6
V
Input Voltages
VIN
–0.3
VDDIO + 0.3
V
Junction Temperature
TJ
–40
125
C
相關(guān)PDF資料
PDF描述
ORLI10G-2BM680 FPGA, 1296 CLBS, 380000 GATES, PBGA680
ORLI10G-3BM416 FPGA, 1296 CLBS, 380000 GATES, PBGA416
ORLI10G-3BM680 FPGA, 1296 CLBS, 380000 GATES, PBGA680
ORLI10G1BM680-DB FPGA, 1296 CLBS, 333000 GATES, PBGA680
ORLI10G2BM680-DB FPGA, 1296 CLBS, 333000 GATES, PBGA680
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ORLI10G-2BM680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORLI10G-2BM680I 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORLI10G-2BMN680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORLI10G-2BMN680I 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORLI10G-3BM680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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