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參數(shù)資料
| 型號： | OQ2541BHP |
| 英文描述： | CLOCK/DATA RECOVERY|BIPOLAR|QFP|48PIN|PLASTIC |
| 中文描述： | 時(shí)鐘/數(shù)據(jù)恢復(fù)|雙極| QFP封裝| 48PIN |塑料 |
| 文件頁數(shù)： | 32/40頁 |
| 文件大小： | 292K |
| 代理商： | OQ2541BHP |
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2000 Sep 18
32
Philips Semiconductors
Product specification
SDH/SONET data and clock recovery unit
STM1/4/16 OC3/12/48 GE
OQ2541BHP; OQ2541BU
Table 7
Physical characteristics of bare die
Thermal considerations
To improve heat transfer away from the product, a large area fill is recommended as a die pad. The die should be
mounted on this with a heat conductive glue. All supply and ground pads must be bonded to ensure good electrical
performance; this also improves heat transfer to the die pad or other copper area fills. The more copper leading away
from the die, the better the heat transport. In turn, this copper should be able to lose its heat to the environment through
radiation, natural convection (unforced airflow over the printed-circuit board) or forced cooling.
NAME
DESCRIPTION
Glass passivation
Bonding pad dimension
Metallization
Thickness
Size
Backing
Attach temperature
Attach time
0.8
μ
m silicon nitride on top of 0.9
μ
m PSG (PhosphoSilicate Glass)
minimum dimension of exposed metallization is 90
×
90
μ
m (pad size = 100
×
100
μ
m)
1.8
μ
m AlCu (1% Cu)
380
μ
m nominal
2.360
×
2.360 mm (5.5696 mm
2
)
silicon; electrically connected to V
EE
potential through substrate contacts
<440
°
C; recommended die attach is glue
<15 s
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