參數(shù)資料
型號: OQ2541BHP
英文描述: CLOCK/DATA RECOVERY|BIPOLAR|QFP|48PIN|PLASTIC
中文描述: 時鐘/數(shù)據(jù)恢復(fù)|雙極| QFP封裝| 48PIN |塑料
文件頁數(shù): 30/40頁
文件大?。?/td> 292K
代理商: OQ2541BHP
2000 Sep 18
30
Philips Semiconductors
Product specification
SDH/SONET data and clock recovery unit
STM1/4/16 OC3/12/48 GE
OQ2541BHP; OQ2541BU
BONDING PAD LOCATIONS
Table 6
Bonding pad locations.
Note
1.
All x and y coordinates represent the position of the
centreofthepadin
μ
mwithrespecttothecentreofthe
die (see Fig.33).
SYMBOL
PAD
COORDINATES
(1)
x
y
ENL
GND
CLOOP
CLOOPQ
GND
DLOOP
DLOOPQ
GND
DREF19
BYPASS
GND
LOCK
i.c.
GND
CAPUPQ
CAPDOQ
GND
i.c.
i.c.
GND
CREF
CREFQ
GND
ALLON
V
EE1
GND
DOUT1250
DOUT622
GND
DOUT155
V
EE2
GND
DIN
DINQ
GND
i.c.
PC
1
2
3
4
5
6
7
8
9
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
852.5
697.5
542.5
387.5
232.5
77.5
+77.5
+232.5
+387.5
+542.5
+697.5
+852.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+852.5
+852.5
+697.5
+542.5
+387.5
+232.5
+77.5
77.5
232.5
387.5
542.5
697.5
852.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
852.5
697.5
542.5
387.5
232.5
77.5
+77.5
+232.5
+387.5
+542.5
+697.5
+852.5
+1017.5
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
GND
LOS
i.c.
GND
DOUT
DOUTQ
GND
COUT
COUTQ
GND
AREF
38
39
40
41
42
43
44
45
46
47
48
+697.5
+542.5
+387.5
+232.5
+77.5
77.5
232.5
387.5
542.5
697.5
852.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
SYMBOL
PAD
COORDINATES
(1)
x
y
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