參數(shù)資料
型號: NAND512W4A0BZA1F
廠商: NUMONYX
元件分類: PROM
英文描述: 32M X 16 FLASH 3V PROM, 35 ns, PBGA63
封裝: 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-63
文件頁數(shù): 49/57頁
文件大?。?/td> 916K
代理商: NAND512W4A0BZA1F
53/57
NAND128-A, NAND256-A, NAND512-A, NAND01G-A
PART NUMBERING
Table 28. Ordering Information Scheme
Devices are shipped from the factory with the memory content bits, in valid blocks, erased to ’1’.
For further information on any aspect of this device, please contact your nearest ST Sales Office.
Example:
NAND512R3A
0
A ZA
1
T
Device Type
NAND = NAND Flash Memory
Density
128 = 128Mb
256 = 256Mb
512 = 512Mb
01G = 1Gb
Operating Voltage
R = VDD = 1.7 to 1.95V
W = VDD = 2.7 to 3.6V
Bus Width
3 = x8
4 = x16
Family Identifier
A = 528 Bytes/ 264 Word Page
Device Options
0 = No Options
2 = Chip Enable Don’t Care Enabled
Product Version
A = First Version
B = Second Version
C = Third Version
Package
N = TSOP48 12 x 20mm (all devices)
V = USOP48 12 x 17 x 0.65mm (128Mbit, 256Mbit and 512Mbit devices)
ZA = VFBGA55 8 x 10 x 1mm, 6x8 ball array, 0.8mm pitch (128Mbit and 256Mbit devices)
ZB = TFBGA55 8 x 10 x 1.2mm, 6x8 ball array, 0.8mm pitch (512Mbit Dual Die devices)
ZA = VFBGA63 9 x 11 x 1mm, 6x8 ball array, 0.8mm pitch (512Mbit devices)
ZB = TFBGA63 9 x 11 x 1.2mm, 6x8 ball array, 0.8mm pitch (1Gbit Dual Die devices)
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Option
blank = Standard Packing
T = Tape & Reel Packing
E = Lead Free Package, Standard Packing
F = Lead Free Package, Tape & Reel Packing
相關(guān)PDF資料
PDF描述
NAND512W4A0BZB1E 32M X 16 FLASH 3V PROM, 35 ns, PBGA55
NAND512R3A0CV1F 64M X 8 FLASH 1.8V PROM, 35 ns, PDSO48
NAND512R3A0AN6E 64M X 8 FLASH 1.8V PROM, 35 ns, PDSO48
NAND512R3A0AZA6E 64M X 8 FLASH 1.8V PROM, 35 ns, PBGA63
NAND512R3A2AN6T 64M X 8 FLASH 1.8V PROM, 35 ns, PDSO48
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