參數(shù)資料
型號(hào): NAND02GW3B3BZB1F
廠商: NUMONYX
元件分類(lèi): PROM
英文描述: 256M X 8 FLASH 3V PROM, 35 ns, PBGA63
封裝: 9.50 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-63
文件頁(yè)數(shù): 9/59頁(yè)
文件大小: 998K
代理商: NAND02GW3B3BZB1F
17/59
NAND512-B, NAND01G-B, NAND02G-B, NAND04G-B, NAND08G-B
Table 8. Address Definitions, x8
Table 9. Address Definitions, x16
Address
Definition
A0 - A11
Column Address
A12 - A17
Page Address
A18 - A26
Block Address
512Mb device
A18 - A27
Block Address
1Gb device
A18 - A28
Block Address
2Gb device
A18 - A29
Block Address
4Gb device
A18 - A30
Block Address
8Gb device
Address
Definition
A0 - A10
Column Address
A11 - A16
Page Address
A17 - A25
Block Address
512Mb device
A17 - A26
Block Address
1Gb device
A17 - A27
Block Address
2Gb device
A17 - A28
Block Address
4Gb device
A17 - A29
Block Address
8Gb device
相關(guān)PDF資料
PDF描述
NAND02GW3B3BN1F 256M X 8 FLASH 3V PROM, 35 ns, PDSO48
NAND02GW3B3CN6 256M X 8 FLASH 3V PROM, 35 ns, PDSO48
NAND04GR3B3BN1F 512M X 8 FLASH 1.8V PROM, 35 ns, PDSO48
NAND512W3B3BN1E 64M X 8 FLASH 3V PROM, 35 ns, PDSO48
NAND512W3B3CN6E 64M X 8 FLASH 3V PROM, 35 ns, PDSO48
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
NAND04GR3B2DDI6 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film
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NAND04GR3B2DZL6F 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel
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NAND04GR3B2EN6F 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel