參數(shù)資料
型號: MPE603RRX300LX
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255
封裝: CERAMIC, BGA-255
文件頁數(shù): 7/28頁
文件大?。?/td> 208K
代理商: MPE603RRX300LX
MOTOROLA
EC603e Microprocessor Hardware Specifications (PID7t), Rev. 2.0
15
1.5 Pin Assignments
Figure 9
(in part A) shows the pinout of the CBGA package as viewed from the top surface. Part B
shows the side profile of the CBGA package to indicate the direction of the top surface view.
Part A
Figure 9. Pinout of the CBGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Not to Scale
Part B
Substrate Assembly
Encapsulant
View
Die
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