參數(shù)資料
型號(hào)： MPE603RRX300LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255
封裝： CERAMIC, BGA-255
文件頁(yè)數(shù)： 17/28頁(yè)
文件大?。?/td> 208K
代理商： MPE603RRX300LX
24
EC603e Microprocessor Hardware Specifications (PID7t), Rev. 2.0
MOTOROLA
1.8.6.2 Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 14 shows the thermal performance of three thin-sheet thermal-interface materials (silicone, graphite/
oil, oroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure. As shown,
the performance of these thermal interface materials improves with increasing contact pressure. The use of
thermal grease signicantly reduces the interface thermal resistance. That is, the bare joint results in a
thermal resistance approximately 7 times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 12). This spring force should not exceed 5.5 pounds of force. Therefore, the synthetic grease offers
the best thermal performance, considering the low interface pressure. Of course, the selection of any thermal
interface material depends on many factorsthermal performance requirements, manufacturability, service
temperature, dielectric properties, cost, etc.
Figure 14. Thermal Performance of Select Thermal Interface Material
0
0.5
1
1.5
2
0
1020304050607080
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
Contact Pressure (psi)
Specific
Thermal
Resistance
(Kin
2
/W)
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