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參數資料
| 型號： | MPE603RRX300LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | CERAMIC, BGA-255 |
| 文件頁數： | 16/28頁 |
| 文件大?。?/td> | 208K |
| 代理商： | MPE603RRX300LX |
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MOTOROLA
EC603e Microprocessor Hardware Specifications (PID7t), Rev. 2.0
23
The board designer can choose between several types of heat sinks to place on the PID7t. There are several
commercially-available heat sinks for the PID7t provided by the following vendors:
Chip Coolers Inc.
800-227-0254 (USA/Canada)
333 Strawberry Field Rd.
401-739-7600
Warwick, RI 02887-6979
International Electronic Research Corporation (IERC)
818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Thermalloy
214-243-4321
2021 W. Valley View Lane
P.O. Box 810839
Dallas, TX 75731
Wakeeld Engineering
617-245-5900
60 Audubon Rd.
Wakeeld, MA 01880
Aavid Engineering
603-528-3400
One Kool Path
Laconia, NH 03247-0440
Ultimately, the nal selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.8.6.1 Internal Package Conduction Resistance
For this packaging technology the intrinsic thermal conduction resistance (shown in Table 3) versus the
external thermal resistance paths are shown in Figure 13 for a package with an attached heat sink mounted
to a printed-circuit board.
Figure 13. Package with Heat Sink Mounted to a Printed-Circuit Board
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
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