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參數(shù)資料
| 型號： | MPE603RRX300LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | CERAMIC, BGA-255 |
| 文件頁數(shù)： | 24/28頁 |
| 文件大?。?/td> | 208K |
| 代理商： | MPE603RRX300LX |
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MOTOROLA
EC603e Microprocessor Hardware Specifications (PID7t), Rev. 2.0
5
Table 2 provides the recommended operating conditions for the PID7t.
Table 3 provides the package thermal characteristics for the PID7t.
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Value
Unit
Core supply voltage
Vdd
2.375 to 2.625
V
PLL supply voltage
AVdd
2.375 to 2.625
V
I/O supply voltage
OVdd
3.135 to 3.465
V
Input voltage
Vin
GND to 5.5
V
Die-junction temperature
Tj
0 to 105
C
Note: These are the recommended and tested operating conditions. Proper device operation outside of
these conditions is not guaranteed.
Table 3. Package Thermal Characteristics
Characteristic
Symbol
Value
Rating
CBGA package die junction-to-case thermal resistance (typical)
qJC
0.095
C/W
CBGA package die junction-to-ball thermal resistance (typical)
qJB
3.5
C/W
Note: Refer to Section 1.8, System Design Information, for more details about thermal management.
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