參數(shù)資料
型號: MPC8360ECVVAJDGA
廠商: Freescale Semiconductor
文件頁數(shù): 64/102頁
文件大?。?/td> 0K
描述: IC MPU POWERQUICC II PRO 740TBGA
標準包裝: 21
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 533MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 740-LBGA
供應(yīng)商設(shè)備封裝: 740-TBGA(37.5x37.5)
包裝: 托盤
配用: MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM
MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
64
Freescale Semiconductor
Mechanical Dimensions of the TBGA Package
20.2
Mechanical Dimensions of the TBGA Package
This figure depicts the mechanical dimensions and bottom surface nomenclature of the device, 740-TBGA package.
Figure 53. Mechanical Dimensions and Bottom Surface Nomenclature of the TBGA Package
相關(guān)PDF資料
PDF描述
XF2B-1745-31A CONN FPC 17POS 0.3MM PITCH SMD
FMM43DSEN-S243 CONN EDGECARD 86POS .156 EYELET
XCS20-3PQ208C IC FPGA 5V C-TEMP 208-PQFP
XCS10XL-5VQ100C IC FPGA 3.3V C-TEMP 100-VQFP
XCS10XL-5TQ144C IC FPGA 3.3V C-TEMP 144-TQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8360ECVVAJDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVAJFGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVAJFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVALDGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVALDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications