- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄4057 > MPC8360ECVVAJDGA (Freescale Semiconductor)IC MPU POWERQUICC II PRO 740TBGA PDF資料下載
參數(shù)資料
| 型號(hào)： | MPC8360ECVVAJDGA |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 102/102頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU POWERQUICC II PRO 740TBGA |
| 標(biāo)準(zhǔn)包裝： | 21 |
| 系列： | MPC83xx |
| 處理器類(lèi)型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 533MHz |
| 電壓： | 1.2V |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 740-LBGA |
| 供應(yīng)商設(shè)備封裝： | 740-TBGA（37.5x37.5） |
| 包裝： | 托盤(pán) |
| 配用： | MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)當(dāng)前第102頁(yè)
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
99
Pull-Up Resistor Requirements
23.7
Pull-Up Resistor Requirements
The device requires high resistance pull-up resistors (10 k
Ωis recommended) on open drain type pins including I2C pins,
Ethernet Management MDIO pin, and EPIC interrupt pins.
For more information on required pull-up resistors and the connections required for the JTAG interface, see
MPC8360E/MPC8358E PowerQUICC Design Checklist (AN3097).
24
Ordering Information
24.1
Part Numbers Fully Addressed by this Document
This table provides the Freescale part numbering nomenclature for the MPC8360E/58E. Note that the individual part numbers
correspond to a maximum processor core frequency. For available frequencies, contact your local Freescale sales office.
Additionally to the processor frequency, the part numbering scheme also includes an application modifier, which may specify
special application conditions. Each part number also contains a revision code that refers to the die mask revision number.
This table shows the SVR settings by device and package type.
Table 80. Part Numbering Nomenclature1
MPC nnnn
e
t
pp
aa
a
A
Product
Code
Part
Identifier
Encryption
Acceleration
Temperature
Range
Package2
Processor
Frequency3
Platform
Frequency
QUICC
Engine
Frequency
Die
Revision
MPC
8358
Blank = not
included
E = included
Blank = 0
° C
TA to 105° C
TJ
C= –40
° C TA
to 105
° C TJ
ZU = TBGA
VV = TBGA
(no lead)
e300 core speed
AD = 266 MHz
AG = 400 MHz
D = 266 MHz
E = 300 MHz
G = 400 MHz
A = rev. 2.1
silicon
8360
e300 core speed
AG = 400 MHz
AJ = 533 MHz
AL = 667 MHz
D = 266 MHz
F = 333 MHz
G = 400 MHz
H = 500 MHz
A = rev. 2.1
silicon
MPC
(rev. 2.0
silicon
only)
8360
Blank = not
included
E = included
0
° C TA to
70
° C TJ
ZU = TBGA
VV = TBGA
(no lead)
e300 core speed
AH = 500 MHz
AL = 667 MHz
F = 333 MHz
G = 400 MHz
H = 500 MHz
—
Notes:
1. Not all processor, platform, and QUICC Engine block frequency combinations are supported. For available frequency
combinations, contact your local Freescale sales office or authorized distributor.
2. See Section 20, “Package and Pin Listings,” for more information on available package types.
3. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by part number specifications may support other
maximum core frequencies.
Table 81. SVR Settings
Device
Package
SVR
(Rev. 2.0)
SVR
(Rev. 2.1)
MPC8360E
TBGA
0x8048_0020
0x8048_0021
MPC8360
TBGA
0x8049_0020
0x8049_0021
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XF2B-1745-31A | CONN FPC 17POS 0.3MM PITCH SMD |
| FMM43DSEN-S243 | CONN EDGECARD 86POS .156 EYELET |
| XCS20-3PQ208C | IC FPGA 5V C-TEMP 208-PQFP |
| XCS10XL-5VQ100C | IC FPGA 3.3V C-TEMP 100-VQFP |
| XCS10XL-5TQ144C | IC FPGA 3.3V C-TEMP 144-TQFP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8360ECVVAJDHA | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECVVAJFGA | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECVVAJFHA | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECVVALDGA | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECVVALDHA | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。