參數(shù)資料
型號(hào)： MPC8260ACZUMIBB
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 28/50頁(yè)
文件大?。?/td> 0K
描述： IC MPU POWERQUICC II 480-TBGA
標(biāo)準(zhǔn)包裝： 21
系列： MPC82xx
處理器類(lèi)型： 32-位 MPC82xx PowerQUICC II
速度： 266MHz
電壓： 2V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 480-LBGA
供應(yīng)商設(shè)備封裝： 408-TBGA（37.5x37.5）
包裝： 托盤(pán)
配用： MPC8260ADS-TCOM-ND - BOARD DEV ADS POWERQUICC II
MPC8260A PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2.0
34
Freescale Semiconductor
Pinout
Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
Figure 14. Side View of the TBGA Package
Table 21 shows the pinout list of the MPC826xA. Table 20 defines conventions and acronyms used in
Symbols used in Table 21 are described in Table 20.
Table 20. Symbol Legend
Symbol
Meaning
OVERBAR
Signals with overbars, such as TA, are active low.
UTM
Indicates that a signal is part of the UTOPIA master interface.
UTS
Indicates that a signal is part of the UTOPIA slave interface.
UT8
Indicates that a signal is part of the 8-bit UTOPIA interface.
UT16
Indicates that a signal is part of the 16-bit UTOPIA interface.
MII
Indicates that a signal is part of the media independent interface.
Table 21. Pinout List
Pin Name
Ball
BR
W5
BG
F4
ABB/IRQ2
E2
TS
E3
A0
G1
A1
H5
A2
H2
A3
H1
A4
J5
A5
J4
A6
J3
A7
J2
Soldermask
Copper Traces
Die
Copper Heat Spreader
(Oxidized for Insulation)
1.27 mm Pitch
Glob-Top Dam
Wire Bonds
Etched
Pressure Sensitive
Die
Glob-Top Filled Area
Polymide Tape
Cavity
Adhesive
Attach
View
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