| 型號: | MPC2106SG66 | 
| 廠商: | MOTOROLA INC | 
| 元件分類: | DRAM | 
| 英文描述: | 256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms | 
| 中文描述: | 128K X 72 CACHE SRAM MODULE, 9 ns, PDMA182 | 
| 文件頁數(shù): | 1/20頁 | 
| 文件大?。?/td> | 245K | 
| 代理商: | MPC2106SG66 | 

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| 相關(guān)代理商/技術(shù)參數(shù) | 參數(shù)描述 | 
|---|---|
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| MPC222225T | 制造商:AMEC THERMASOL 功能描述:HEAT SINK CERAMIC 22*22*2.5 STD ADHESIV 制造商:AMEC THERMASOL 功能描述:HEAT SINK, CERAMIC 22*22*2.5 STD ADHESIV 制造商:AMEC THERMASOL 功能描述:HEAT SINK; Thermal Resistance:10.21C/W; External Height - Imperial:0.098"; External Height - Metric:2.5mm; External Width - Imperial:0.866"; External Width - Metric:22mm; External Length - Imperial:0.866"; Heat Sink Material:Ceramic;RoHS Compliant: Yes | 
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