MCF548x ColdFire Microprocessor, Rev. 4 Freescale Semiconductor 19 DD1" />
參數(shù)資料
型號(hào)： MCF5485CZP200
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 11/34頁(yè)
文件大?。?/td> 0K
描述： IC MPU 32BIT COLDF 388-PBGA
標(biāo)準(zhǔn)包裝： 40
系列： MCF548x
核心處理器： Coldfire V4E
芯體尺寸： 32-位
速度： 200MHz
連通性： CAN，EBI/EMI，以太網(wǎng)，I²C，SPI，UART/USART，USB
外圍設(shè)備： DMA，PWM，WDT
輸入/輸出數(shù)： 99
程序存儲(chǔ)器類型： ROMless
RAM 容量： 32K x 8
電壓 - 電源 (Vcc/Vdd)： 1.43 V ~ 1.58 V
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 388-BBGA
包裝： 托盤
SDRAM Bus
MCF548x ColdFire Microprocessor, Rev. 4
Freescale Semiconductor
19
DD13
DQS input read preamble width (tRPRE)
0.9
1.1
SDCLK
DD14
DQS input read postamble width (tRPST)
0.4
0.6
SDCLK
DD15
DQS output write preamble width (tWPRE)0.25
—
SDCLK
DD16
DQS output write postamble width (tWPST)
0.4
0.6
SDCLK
1
DDR memories typically have a minimum speed specification of 83 MHz. Check memory component specifications to verify.
2 The frequency of operation is 2x or 4x the CLKIN frequency of operation. The MCF548X supports a single external
reference clock (CLKIN). This signal defines the frequency of operation for FlexBus and PCI, but SDRAM clock operates at
the same frequency as the internal bus clock. Please see the reset configuration signals description in the “Signal
Descriptions” chapter within the MCF548x Reference Manual.
3 SDCLK is one memory clock in (ns).
4 Pulse width high plus pulse width low cannot exceed max clock period.
5 Pulse width high plus pulse width low cannot exceed max clock period.
6 Command output valid should be 1/2 the memory bus clock (SDCLK) plus some minor adjustments for process,
temperature, and voltage variations.
7 This specification relates to the required input setup time of today’s DDR memories. SDDATA[31:24] is relative to SDDQS3,
SDDATA[23:16] is relative to SDDQS2, SDDATA[15:8] is relative to SDDQS1, and SDDATA[7:0] is relative SDDQS0.
8 The first data beat is valid before the first rising edge of SDDQS and after the SDDQS write preamble. The remaining data
beats is valid for each subsequent SDDQS edge.
9 This specification relates to the required hold time of today’s DDR memories. SDDATA[31:24] is relative to SDDQS3,
SDDATA[23:16] is relative to SDDQS2, SDDATA[15:8] is relative to SDDQS1, and SDDATA[7:0] is relative SDDQS0.
10 Data input skew is derived from each SDDQS clock edge. It begins with a SDDQS transition and ends when the last data
line becomes valid. This input skew must include DDR memory output skew and system level board skew (due to routing
or other factors).
11 Data input hold is derived from each SDDQS clock edge. It begins with a SDDQS transition and ends when the first data
line becomes invalid.
Table 13. DDR Timing Specifications (continued)
Symbol
Characteristic
Min
Max
Unit
Notes
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