參數(shù)資料
型號: MCF5275CVM133
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 133 MHz, RISC PROCESSOR, PBGA256
封裝: MAPBGA-256
文件頁數(shù): 3/44頁
文件大?。?/td> 1242K
代理商: MCF5275CVM133
Design Recommendations
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 2
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
11
2. VDD/PLLVDD and OVDD/SDVDD should track up to 0.9 V, then separate for the completion of
ramps with OVDD/SD VDD going to the higher external voltages. One way to accomplish this is to
use a low drop-out voltage regulator.
5.2.1.2
Power Down Sequence
If VDD/PLLVDD are powered down first, then sense circuits in the I/O pads will cause all output drivers to
be in a high impedance state. There is no limit on how long after VDD and PLLVDD power down before
OVDD or SDVDD must power down. VDD should not lag OVDD, SDVDD, or PLLVDD going low by more
than 0.4 V during power down or there will be undesired high current in the ESD protection diodes. There
are no requirements for the fall times of the power supplies.
The recommended power down sequence is as follows:
1. Drop VDD/PLLVDD to 0 V.
2. Drop OVDD/SDVDD supplies.
5.3
Decoupling
Place the decoupling capacitors as close to the pins as possible, but they can be outside the footprint
of the package.
0.1
F and 0.01 F at each supply input
5.4
Buffering
Use bus buffers on all data/address lines for all off-board accesses and for all on-board accesses
when excessive loading is expected. See electricals.
5.5
Pull-up Recommendations
Use external pull-up resistors on unused inputs. See pin table.
5.6
Clocking Recommendations
Use a multi-layer board with a separate ground plane.
Place the crystal and all other associated components as close to the EXTAL and XTAL (oscillator
pins) as possible.
Do not run a high frequency trace around crystal circuit.
Ensure that the ground for the bypass capacitors is connected to a solid ground trace.
Tie the ground trace to the ground pin nearest EXTAL and XTAL. This prevents large loop currents
in the vicinity of the crystal.
Tie the ground pin to the most solid ground in the system.
Do not connect the trace that connects the oscillator and the ground plane to any other circuit
element. This tends to make the oscillator unstable.
Tie XTAL to ground when an external oscillator is clocking the device.
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