參數(shù)資料
型號： MCF5208_07
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述： Microprocessor Data Sheet
中文描述： 微處理器數(shù)據(jù)表
文件頁數(shù)： 19/46頁
文件大?。?/td> 480K
代理商： MCF5208_07
Electrical Characteristics
MCF5208 ColdFire
Microprocessor Data Sheet, Rev. 1
Freescale Semiconductor
19
Junction to board
θ
JB
36
3
36
3
40
3
50
3
°
C / W
Junction to case
θ
JC
22
4
22
4
39
4
19
4
°
C / W
Junction to top of package
Ψ
jt
6
1,5
6
1,5
12
1,6
5
1,7
°
C / W
Maximum operating junction temperature
T
j
105
105
105
105
o
C
NOTES:
1
θ
JMA
and
Ψ
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
θ
JmA
and power dissipation specifications in the system design to prevent device junction temperatures
from exceeding the rated specification. System designers should be aware that device junction temperatures can be significantly
influenced by board layout and surrounding devices. Conformance to the device junction temperature specification can be
verified by physical measurement in the customer’s system using the
Ψ
jt
parameter, the device power dissipation, and the
method described in EIA/JESD Standard 51-2.
2
Per JEDEC JESD51-6 with the board horizontal.
3
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
4
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
5
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance
with Psi-JT.
6
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance
with Psi-JT.
7
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance
with Psi-JT.
Table 5. Thermal Characteristics (continued)
Characteristic
Symbol
196MBGA 144MBGA 160QFP 144LQFP
Unit
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCF5208CAB166 功能描述:32位微控制器 - MCU MPC5208 MINIME 160 MQFP RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MCF5208CVM166 功能描述:IC MCU 32-BIT 196-MAPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MCF520x 標(biāo)準(zhǔn)包裝:330 系列:- 核心處理器:- 芯體尺寸:8/16-位 速度:40MHz 連通性:UART/USART 外圍設(shè)備:DMA，PWM，WDT 輸入/輸出數(shù):32 程序存儲器容量:- 程序存儲器類型:外部程序存儲器 EEPROM 大小:- RAM 容量:- 電壓 - 電源 (Vcc/Vdd):4.5 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:100-BQFP 包裝:管件
MCF5208CVM166J 功能描述:32位微控制器 - MCU ColdFire Micro-Proc RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MCF5208EC 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor
MCF5208EC_08 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MCF5208 ColdFire? Microprocessor Data Sheet
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