參數(shù)資料
型號： MC56F8157
廠商： Electronic Theatre Controls, Inc.
英文描述： 16-BIT HYBRID CONTROLLERS
中文描述： 16位混合控制器
文件頁數(shù)： 167/172頁
文件大?。?/td> 2444K
代理商： MC56F8157
Thermal Design Considerations
56F8357 Technical Data, Rev. 8.0
Freescale Semiconductor
Preliminary
167
Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, T
J
, can be obtained from the equation:
T
J
= T
A
+ (R
θ
J
Α
x
P
D
)
where:
= Ambient temperature for the package (
o
C)
R
θ
J
Α
= Junction-to-ambient thermal resistance (
o
C/W)
P
D
= Power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single-layer board and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is closer to the application
depends on the power dissipated by other components on the board. The value obtained on a single-layer
board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the
internal planes is usually appropriate if the board has low-power dissipation and the components are well
separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
R
θ
J
Α =
R
θ
J
Χ +
R
θ
C
Α
where:
R
θ
JC
is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, R
θ
CA
. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
Thermal Characterization Parameter (
Ψ
JT
) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
T
J
= T
T
+ (
Ψ
JT
x P
D
)
where:
Thermocouple temperature on top of package (
o
C)
Ψ
JT
=
P
D
=
Power dissipation in package (W)
T
A
R
θ
JA
R
θ
JC
R
θ
CA
= Package junction-to-ambient thermal resistance °C/W
= Package junction-to-case thermal resistance °C/W
= Package case-to-ambient thermal resistance °C/W
T
T
=
Thermal characterization parameter (
o
C)/W
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MC56F8157VPYE 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 16 BIT HYBRID CONTROLLER RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
MC56F8157VVFE 功能描述:IC DGTL SIGNAL CTLR 160-MAPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:56F8xxx 標(biāo)準(zhǔn)包裝:1 系列:87C 核心處理器:MCS 51 芯體尺寸:8-位 速度:16MHz 連通性:SIO 外圍設(shè)備:- 輸入/輸出數(shù):32 程序存儲器容量:8KB（8K x 8） 程序存儲器類型:OTP EEPROM 大小:- RAM 容量:256 x 8 電壓 - 電源 (Vcc/Vdd):4 V ~ 6 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:外部 工作溫度:0°C ~ 70°C 封裝/外殼:44-DIP 包裝:管件 其它名稱:864285
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MC56F8165E 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers
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