參數(shù)資料
型號(hào)： MC56F8014VFAE
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 數(shù)字信號(hào)處理
英文描述： 0-BIT, 8 MHz, OTHER DSP, PQFP32
封裝： ROHS COMPLIANT, PLASTIC, LQFP-32
文件頁數(shù)： 23/124頁
文件大?。?/td> 1681K
代理商： MC56F8014VFAE
56F8014 Package and Pin-Out Information
56F8014 Technical Data, Rev. 11
Freescale Semiconductor
119
Figure 11-2 56F8014 32-Pin LQFP Mechanical Information
DETAIL Y
A
S1
V
B
1
8
9
17
25
32
AE
P
DETAIL Y
BASE
N
J
D
F
METAL
SECTION AE–AE
G
SEATING
PLANE
R
Q
W
K
X
0.250
(0.010)
GAUGE
PLANE
E
C
H
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
DIM
A
MIN
MAX
MIN
MAX
INCHES
7.000 BSC
0.276 BSC
MILLIMETERS
B
7.000 BSC
0.276 BSC
C
1.400
1.600
0.055
0.063
D
0.300
0.450
0.012
0.018
E
1.350
1.450
0.053
0.057
F
0.300
0.400
0.012
0.016
G
0.800 BSC
0.031 BSC
H
0.050
0.150
0.002
0.006
J
0.090
0.200
0.004
0.008
K
0.500
0.700
0.020
0.028
M
12 REF
N
0.090
0.160
0.004
0.006
P
0.400 BSC
0.016 BSC
Q
1
5
1
5
R
0.150
0.250
0.006
0.010
V
9.000 BSC
0.354 BSC
V1
4.500 BSC
0.177 BSC
DETAIL AD
A1
B1
V1
4X
S
4X
B1
3.500 BSC
0.138 BSC
A1
3.500 BSC
0.138 BSC
S
9.000 BSC
0.354 BSC
S1
4.500 BSC
0.177 BSC
W
0.200 REF
0.008 REF
X
1.000 REF
0.039 REF
9
–T–
–Z–
–U–
T–U
0.20 (0.008)
Z
AC
T–U
0.20 (0.008)
Z
AB
0.10 (0.004) AC
–AC–
–AB–
M
8X
–T–,
–U–,
–Z–
T–U
M
0.20
(0.008)
Z
AC
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