參數(shù)資料
型號(hào)： MC56603APV60
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 數(shù)字信號(hào)處理
英文描述： 24-BIT, 60 MHz, OTHER DSP, PQFP144
封裝： PLASTIC, TQFP-144
文件頁數(shù)： 85/97頁
文件大?。?/td> 1080K
代理商： MC56603APV60
4-2
DSP56603A Technical Data Sheet
MOTOROLA
DSP56603A
Thermal Design Considerations
RqJA do not satisfactorily answer whether the thermal performance is adequate, a
system level model may be appropriate.
A complicating factor is the existence of three common definitions for determining
the junction-to-case thermal resistance in plastic packages:
Measure the thermal resistance from the junction to the outside surface of the
package (case) closest to the chip mounting area when that surface has a
proper heat sink. This is done to minimize temperature variation across the
surface.
Measure the thermal resistance from the junction to where the leads are
attached to the case. This definition is approximately equal to a junction to
board thermal resistance.
Use the value obtained by the equation (TJ TT)/PD where TT is the
temperature of the package case determined by a thermocouple.
As noted above, the junction-to-case thermal resistances quoted in this data sheet are
determined using the first definition. From a practical standpoint, that value is also
suitable for determining the junction temperature from a case thermocouple reading
in forced convection environments. In natural convection, using the junction-to-case
thermal resistance to estimate junction temperature from a thermocouple reading on
the case of the package will estimate a junction temperature slightly hotter than
actual. Hence, the new thermal metric, Thermal Characterization Parameter, or
YJT,
has been defined to be (TJ TT)/PD. This value gives a better estimate of the junction
temperature in natural convection when using the surface temperature of the
package. Remember that surface temperature readings of packages are subject to
significant errors caused by inadequate attachment of the sensor to the surface and to
errors caused by heat loss to the sensor. The recommended technique is to attach a 40-
gauge thermocouple wire and bead to the top center of the package with thermally
conductive epoxy.
on page 2-2 contains the package
thermal values for this chip.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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