參數(shù)資料
型號(hào): MAX104
廠商: MAXIM INTEGRATED PRODUCTS INC
元件分類: ADC
英文描述: 【5V, 1Gsps, 8-Bit ADC with On-Chip 2.2GHz Track/Hold Amplifier
中文描述: 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PGA192
文件頁數(shù): 24/32頁
文件大小: 637K
代理商: MAX104
M
of determining the die temperature is to measure each
current with an ammeter (which shuts off the internal
catch diodes) referenced to GNDI. The die temperature
in °C is then calculated by the expression:
Another method of determining the die temperature
uses the operational amplifier circuit shown in Figure 20.
The circuit produces a voltage that is proportional to
the die temperature. A possible application for this sig-
nal is speed control for a cooling fan, to maintain con-
stant MAX104 die temperature. The circuit operates by
converting the I
CONST
and I
PTAT
currents to voltages
V
CONST
and V
PTAT
, with appropriate scaling to account
for their equal values at +27°C. This voltage difference
is then amplified by two amplifiers in an instrumenta-
tion-amplifier configuration with adjustable gain. The
nominal value of the circuit gain is 4.5092V/V. The gain
of the instrumentation amplifier is given by the expres-
sion:
A
V
CONST
To calibrate the circuit, first connect pins 2-3 on J U1 to
zero the input of the PTAT path. With the MAX104 pow-
ered up, adjust potentiometer R3 until the voltage at the
V
TEMP
output is -2.728V. Connecting pins 1-2 on J U1
restores normal operation to the circuit after the calibra-
tion is complete. The voltage at the V
TEMP
node will
then be proportional to the actual MAX104 die tempera-
ture according to the equation:
T
DIE
(°C) = 100
·
V
TEMP
The overall accuracy of the die temperature measure-
ment using the operational-amplifier scaling circuitry is
limited mainly by the accuracy and matching of the
resistors in the circuit.
T hermal Management
Depending on the application environment for the
ESBGA-packaged MAX104, the customer may have to
apply an external heatsink to the package after board
assembly. Existing open-tooled heatsinks are available
from standard heatsink suppliers (see Heatsink
Manufacturers). The heatsinks are available with pre-
applied adhesive for easy package mounting.
V
V
A
R
R
R
R
V
TEMP
PTAT
V
1
=
=
+
+
1
2
2
1
3
T
I
I
DIE
PTAT
CONST
=
300
273
±5V, 1Gsps, 8-Bit ADC with
On-Chip 2.2GHz Trac k/Hold Amplifier
24
______________________________________________________________________________________
V
CONST
V
TEMP
R1
7.5k
R2
15k
R2
15k
3.32k
5k
R1
7.5k
6.65k
6.65k
6.05k
12.1k
12.1k
1
2
3
JU1
10-TURN
I
PTAT
V
PTAT
I
CONST
1/4 MAX479
1/4 MAX479
1/4 MAX479
1/4 MAX479
Figure 20. Die Temperature Acquisition Circuit with the MAX479
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