參數(shù)資料
型號: KSZ8051MLLI TR
廠商: Micrel Inc
文件頁數(shù): 42/51頁
文件大?。?/td> 0K
描述: TXRX PHY 10/T100 3.3V MII 48LQFP
特色產(chǎn)品: KSZ8051/8031/8021 Series
標(biāo)準(zhǔn)包裝: 1
類型: PHY 收發(fā)器
驅(qū)動器/接收器數(shù): 1/1
規(guī)程: MII
電源電壓: 1.8V,2.5V,3.3V
安裝類型: 表面貼裝
封裝/外殼: 48-LQFP
供應(yīng)商設(shè)備封裝: 48-LQFP(7x7)
包裝: 標(biāo)準(zhǔn)包裝
配用: 576-3864-ND - BOARD EVALUATION FOR KSZ8051MLL
其它名稱: 576-3888-6
2009 Microchip Technology Inc.
DS22147A-page 47
MCP4017/18/19
7.0
DESIGN CONSIDERATIONS
In the design of a system with the MCP4017/18/19
devices, the following considerations should be taken
into account. These are:
The Power Supply
The Layout
In the design of a system with the MCP4017/18/19
devices, the following considerations should be taken
into account:
7.1
Power Supply Considerations
The typical application will require a bypass capacitor
in order to filter high-frequency noise, which can be
induced onto the power supply's traces. The bypass
capacitor helps to minimize the effect of these noise
sources on signal integrity. Figure 7-1 illustrates an
appropriate bypass strategy.
In this example, the recommended bypass capacitor
value is 0.1 F. This capacitor should be placed as
close to the device power pin (VDD) as possible (within
4mm).
The power source supplying these devices should be
as clean as possible. If the application circuit has
separate digital and analog power supplies, VDD and
VSS should reside on the analog plane.
FIGURE 7-1:
Typical Microcontroller
Connections.
7.2
Layout Considerations
Inductively-coupled AC transients and digital switching
noise can degrade the input and output signal integrity,
potentially
masking
the
MCP4017/18/19’s
performance. Careful board layout will minimize these
effects and increase the Signal-to-Noise Ratio (SNR).
Bench testing has shown that a multi-layer board
utilizing a low-inductance ground plane, isolated inputs,
isolated outputs and proper decoupling are critical to
achieving the performance that the silicon is capable of
providing. Particularly harsh environments may require
shielding of critical signals.
If low noise is desired, breadboards and wire-wrapped
boards are not recommended.
7.2.1
RESISTOR TEMPCO
Characterization curves of the resistor temperature
coefficient (Tempco) are shown in Figure 2-11,
These curves show that the resistor network is
designed to correct for the change in resistance as
temperature increases. This technique reduces the
end to end change is RAB resistance.
VDD
VSS
MCP401
7/18
/1
9
0.1 F
PICmicro
Microco
ntro
ller
0.1 F
SCL
SDA
W
B
A
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