參數(shù)資料
型號: HYB18T512400AF-3.7
廠商: INFINEON TECHNOLOGIES AG
英文描述: 512-Mbit DDR2 SDRAM
中文描述: 512兆位DDR2 SDRAM的
文件頁數(shù): 100/117頁
文件大?。?/td> 2102K
代理商: HYB18T512400AF-3.7
HYB18T512[40/80/16]0AF–[3/3S/3.7/5]
512-Mbit DDR2 SDRAM
Electrical Characteristics
Data Sheet
100
Rev. 1.3, 2005-01
09112003-SDM9-IQ3P
11) MIN (
t
CL
,
t
CH
) refers to the smaller of the actual clock low time and the actual clock high time as provided to the device (i.e.
this value can be greater than the minimum specification limits for
t
CL
and
t
CH
).
12) The
t
HZ
,
t
RPST
and
t
LZ
,
t
RPRE
parameters are referenced to a specific voltage level, which specify when the device output is
no longer driving (
t
HZ
,
t
RPST
), or begins driving (
t
LZ
,
t
RPRE
).
t
HZ
and
t
LZ
transitions occur in the same access time windows
as valid data transitions.These parameters are verified by design and characterization, but not subject to production test.
13) The Auto-Refresh command interval has be reduced to 3.9 μs when operating the DDR2 DRAM in a temperature range
between 85 °C and 95 °C.
14) 0
T
CASE
85 °C
15) 85 °C
<
T
CASE
95 °C
16) x4 & x8 (1k page size)
17) The
t
RRD
timing parameter depends on the page size of the DRAM organization. See Chapter 1.5
18) x16 (2k page size), not on 256Mbit component
19) The maximum limit for the
t
WPST
parameter is not a device limit. The device operates with a greater value for this parameter,
but system performance (bus turnaround) degrades accordingly.
20) Minimum
t
WTR
is two clocks when operating the DDR2-SDRAM at frequencies
200
ΜΗ
z.
21) User can choose two different active power-down modes for additional power saving via MRS address bit A12. In “standard
active power-down mode” (MR, A12 = “0”) a fast power-down exit timing
t
XARD
can be used. In “l(fā)ow active power-down
mode” (MR, A12 =”1”) a slow power-down exit timing
t
XARDS
has to be satisfied.
相關(guān)PDF資料
PDF描述
HYB18T512160AF 512-Mbit DDR2 SDRAM
HYB18T512160AF-3 512-Mbit DDR2 SDRAM
HYB18T512160AF-3.7 512-Mbit DDR2 SDRAM
HYB18T512160AF-3S 512-Mbit DDR2 SDRAM
HYB18T512400AF-3 512-Mbit DDR2 SDRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HYB18T512400AF-5 制造商:Intersil Corporation 功能描述:SDRAM, DDR, 128M x 4, 60 Pin, Plastic, BGA
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HYB18T512800AF-3S 制造商:Qimonda 功能描述: 制造商:Infineon Technologies AG 功能描述:32M X 16 DDR DRAM, 0.45 ns, PBGA84
HYB18T512800BF-2.5 功能描述:IC DDR2 SDRAM 512MBIT 60TFBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:60 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:16K (2K x 8) 速度:2MHz 接口:SPI 3 線串行 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:8-PDIP 包裝:管件 產(chǎn)品目錄頁面:1449 (CN2011-ZH PDF)
HYB18T512800BF-3.7 功能描述:IC DDR2 SDRAM 512MBIT 60TFBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN(2x3) 包裝:管件 產(chǎn)品目錄頁面:1445 (CN2011-ZH PDF)