參數(shù)資料
型號(hào): HB52RF1289E2
廠商: Elpida Memory, Inc.
英文描述: 1 GB Registered SDRAM DIMM 128-Mword 】 72-bit, 133 MHz Memory Bus, 2-Bank Module (36 pcs of 64 M 】 4 Components) PC133 SDRAM
中文描述: 1 GB的注冊(cè)SDRAM的內(nèi)存128 Mword】72位,133 MHz內(nèi)存總線,2銀模塊(36個(gè)64 M】4組件)PC133 SDRAM的
文件頁數(shù): 10/16頁
文件大?。?/td> 161K
代理商: HB52RF1289E2
HB52RF1289E2-75B
Data Sheet E0018H10
10
DC Characteristics
(Ta = 0 to 55°C, V
CC
= 3.3 V ± 0.3 V, V
SS
= 0 V)
HB52RF1289E2-75B
Parameter
Symbol
Min
Max
Unit
Test conditions
Notes
Operating current
I
CC1
I
CC2P
3215
mA
Burst length = 1
t
RC
= min
CKE = V
IL
, t
CK
= 12
ns
1, 2, 3
Standby current in power
down
803
mA
6
Standby current in power
down (input signal stable)
I
CC2PS
767
mA
CKE = V
IL
, t
CK
=
7
Standby current in non
power down
I
CC2N
1415
mA
CKE,
S
= V
IH
,
t
CK
= 12 ns
CKE = V
IL
, t
CK
= 12
ns
CKE,
S
= V
IH
,
t
CK
= 12 ns
t
CK
= min, BL = 4
4
Active standby current in
power down
I
CC3P
839
mA
1, 2, 6
Active standby current in
non power down
I
CC3N
1775
mA
1, 2, 4
Burst operating current
I
CC4
3575
mA
1, 2, 5
Refresh current
I
CC5
I
CC6
5195
mA
t
RC
= min
3
Self refresh current
803
mA
V
IH
V
0.2 V
V
IL
0.2 V
0
Vin
V
CC
0
Vout
V
CC
DQ = disable
8
Input leakage current
I
LI
I
LO
10
10
μA
Output leakage current
10
10
μA
Output high voltage
V
OH
V
OL
2.4
V
I
OH
=
4 mA
I
OL
= 4 mA
Output low voltage
Notes: 1. I
depends on output load condition when the device is selected. I
CC
(max) is specified at the
output open condition.
2. One bank operation.
3. Input signals are changed once per one clock.
4. Input signals are changed once per two clocks.
5. Input signals are changed once per four clocks.
6. After power down mode, CK operating current.
7. After power down mode, no CK operating current.
8. After self refresh mode set, self refresh current.
0.4
V
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