參數(shù)資料
型號(hào): HB52R1289E22
廠商: Elpida Memory, Inc.
英文描述: 1 GB Registered SDRAM DIMM 1 GB Registered SDRAM DIMM (36 pcs of 64 M 】 4 Components) PC100 SDRAM
中文描述: 1 GB的注冊(cè)SDRAM的內(nèi)存1 GB的注冊(cè)SDRAM的內(nèi)存(36個(gè)64 M】4組件)PC100的SDRAM內(nèi)存
文件頁(yè)數(shù): 11/18頁(yè)
文件大?。?/td> 168K
代理商: HB52R1289E22
HB52R1289E22-A6B/B6B
Data Sheet E0017H20
11
DC Characteristics
(Ta = 0 to 55°C, V
CC
= 3.3 V ± 0.3 V, V
SS
= 0 V)
HB52R1289E22
-A6B
-B6B
Parameter
Symbol
Min
Max
Min
Max
Unit
Test conditions
Notes
Operating current
(
CE
latency = 3)
(
CE
latency = 4)
I
CC1
I
CC1
I
CC2P
2945
mA
Burst length = 1
t
RC
= min
1, 2, 3
2945
2945
mA
Standby current in power
down
803
803
mA
CKE = V
IL
, t
CK
= 12
ns
6
Standby current in power
down (input signal stable)
I
CC2PS
767
767
mA
CKE = V
IL
, t
CK
=
7
Standby current in non
power down
I
CC2N
1415
1415
mA
CKE,
S
= V
IH
,
t
CK
= 12 ns
CKE = V
IL
, t
CK
= 12
ns
CKE,
S
= V
IH
,
t
CK
= 12 ns
t
CK
= min, BL = 4
4
Active standby current in
power down
I
CC3P
839
839
mA
1, 2, 6
Active standby current in
non power down
I
CC3N
1775
1775
mA
1, 2, 4
Burst operating current
(
CE
latency = 3)
(
CE
latency = 4)
I
CC4
I
CC4
2945
mA
1, 2, 5
2945
2945
mA
Refresh current
(
CE
latency = 3)
(
CE
latency = 4)
I
CC5
I
CC5
I
CC6
5195
mA
t
RC
= min
3
5195
5195
mA
Self refresh current
803
803
mA
V
IH
V
0.2 V
V
IL
0.2 V
0
Vin
V
CC
0
Vout
V
CC
DQ = disable
8
Input leakage current
I
LI
I
LO
10
10
10
10
μA
Output leakage current
10
10
10
10
μA
Output high voltage
V
OH
V
OL
2.4
2.4
V
I
OH
=
4 mA
I
OL
= 4 mA
Output low voltage
Notes: 1. I
depends on output load condition when the device is selected. I
CC
(max) is specified at the
output open condition.
2. One bank operation.
3. Input signals are changed once per one clock.
4. Input signals are changed once per two clocks.
5. Input signals are changed once per four clocks.
6. After power down mode, CK operating current.
7. After power down mode, no CK operating current.
8. After self refresh mode set, self refresh current.
0.4
0.4
V
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