參數(shù)資料
型號: GS8170DW36C
廠商: GSI TECHNOLOGY
英文描述: 18Mb ヒ1x1Dp CMOS I/O Double Late Write SigmaRAM
中文描述: 35.7ヒ1x1Dp的CMOS的I / O雙晚寫SigmaRAM
文件頁數(shù): 21/27頁
文件大?。?/td> 827K
代理商: GS8170DW36C
GS8170DW36/72C-333/300/250/200
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 2.04 5/2005
21/27
2002, GSI Technology, Inc.
Tap Controller Instruction Set
Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific (Private)
instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be implemented in prescribed
ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load address, data or control signals into the
RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01. When the
controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired instruction is serially
loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the TAP executes newly loaded
instructions only when the controller is moved to Update-IR state. The TAP instruction set for this device is listed in the following table.
Select DR
Capture DR
0
Shift DR
Exit1 DR
Pause DR
Exit2 DR
Update DR
1
Select IR
Capture IR
0
Shift IR
Exit1 IR
Pause IR
Exit2 IR
Update IR
1
Test Logic Reset
Run Test Idle
0
1
0
1
1
0
1
1
1
0
0
1
1
0
0
0
0
1
1
0
0
0
0
0
1
1
1
1
JTAG Tap Controller State Diagram
Instruction Descriptions
BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This
occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facili-
tate testing of other devices in the scan path.
相關(guān)PDF資料
PDF描述
GS8170DW36C-200 18Mb ヒ1x1Dp CMOS I/O Double Late Write SigmaRAM
GS8170DW36C-200I 18Mb ヒ1x1Dp CMOS I/O Double Late Write SigmaRAM
GS8170DW36C-250 18Mb ヒ1x1Dp CMOS I/O Double Late Write SigmaRAM
GS8170DW36C-250I 18Mb ヒ1x1Dp CMOS I/O Double Late Write SigmaRAM
GS8170DW36C-300 18Mb ヒ1x1Dp CMOS I/O Double Late Write SigmaRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS8170DW36C-250 制造商:GSI Technology 功能描述:SRAM SYNC QUAD 1.8V 18MBIT 512KX36 2.1NS 209FBGA - Trays
GS8170DW36C-250I 制造商:GSI Technology 功能描述:SRAM SYNC QUAD 1.8V 18MBIT 512KX36 2.1NS 209FBGA - Trays
GS8170DW72AC-250 制造商:GSI Technology 功能描述:SRAM SYNC OCTAL 1.8V 18MBIT 256KX72 2.1NS 209FBGA - Trays
GS8170DW72AC-250I 制造商:GSI Technology 功能描述:SRAM SYNC OCTAL 1.8V 18MBIT 256KX72 2.1NS 209FBGA - Trays
GS8170DW72AC-300I 制造商:GSI Technology 功能描述:SRAM SYNC OCTAL 1.8V 18MBIT 256KX72 1.8NS 209FBGA - Trays