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參數(shù)資料
| 型號(hào)： | GS8170DW36C |
| 廠商： | GSI TECHNOLOGY |
| 英文描述： | 18Mb ヒ1x1Dp CMOS I/O Double Late Write SigmaRAM |
| 中文描述： | 35.7ヒ1x1Dp的CMOS的I / O雙晚寫SigmaRAM |
| 文件頁(yè)數(shù)： | 20/27頁(yè) |
| 文件大?。?/td> | 827K |
| 代理商： | GS8170DW36C |
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GS8170DW36/72C-333/300/250/200
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 2.04 5/2005
20/27
2002, GSI Technology, Inc.
Register is described in the Scan Order Table following. The Boundary Scan Register, under the control of the TAP Controller, is loaded with the
contents of the RAMs I/O ring when the controller is in Capture-DR state and then is placed between the TDI and TDO pins when the controller is
moved to Shift-DR state. SAMPLE-Z, SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
Instruction Register
ID Code Register
·
31 30 29
Boundary Scan Register
0
1
2
0
· · ·
1
2
0
Bypass Register
TDI
TDO
TMS
TCK
Test Access Port (TAP) Controller
1
·
1
0
·
·
·
·
·
·
·
·
·
Control Signals
·
JTAG TAP Block Diagram
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in Capture-DR state with
the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM. It describes various attributes of the
RAM as indicated below. The register is then placed between the TDI and TDO pins when the controller is moved into Shift-DR state. Bit 0 in the
register is the LSB and the first to reach TDO when shifting begins.
ID Register Contents
Die
Revision
Code
Not Used
I/O
Configuration
GSI Technology
JEDEC Vendor
ID Code
P
Bit #
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
0
x36
X
X
X
X
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0 1 1 0 1 1 0 0 1
1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| GS8170DW36C-200 | 18Mb ヒ1x1Dp CMOS I/O Double Late Write SigmaRAM |
| GS8170DW36C-200I | 18Mb ヒ1x1Dp CMOS I/O Double Late Write SigmaRAM |
| GS8170DW36C-250 | 18Mb ヒ1x1Dp CMOS I/O Double Late Write SigmaRAM |
| GS8170DW36C-250I | 18Mb ヒ1x1Dp CMOS I/O Double Late Write SigmaRAM |
| GS8170DW36C-300 | 18Mb ヒ1x1Dp CMOS I/O Double Late Write SigmaRAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GS8170DW36C-250 | 制造商:GSI Technology 功能描述:SRAM SYNC QUAD 1.8V 18MBIT 512KX36 2.1NS 209FBGA - Trays |
| GS8170DW36C-250I | 制造商:GSI Technology 功能描述:SRAM SYNC QUAD 1.8V 18MBIT 512KX36 2.1NS 209FBGA - Trays |
| GS8170DW72AC-250 | 制造商:GSI Technology 功能描述:SRAM SYNC OCTAL 1.8V 18MBIT 256KX72 2.1NS 209FBGA - Trays |
| GS8170DW72AC-250I | 制造商:GSI Technology 功能描述:SRAM SYNC OCTAL 1.8V 18MBIT 256KX72 2.1NS 209FBGA - Trays |
| GS8170DW72AC-300I | 制造商:GSI Technology 功能描述:SRAM SYNC OCTAL 1.8V 18MBIT 256KX72 1.8NS 209FBGA - Trays |
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