參數(shù)資料
型號: GS1559-CB
廠商: Gennum Corporation
英文描述: GS1559 HD-LINX-TM II Multi-Rate Deserializer with Loop-Through Cable Driver
中文描述: GS1559的HD - LINX進程,商標第二多速率解串器與環(huán)通電纜驅動器
文件頁數(shù): 20/74頁
文件大小: 686K
代理商: GS1559-CB
GS1559 Data Sheet
30572 - 4
July 2005
20 of 74
2.4 Solder Reflow Profiles
The GS1559 is available in a Pb or Pb-free package. It is recommended that the
Pb package be soldered with Pb paste using the Standard Eutectic profile shown
in
Figure 2-1
, and the Pb-free package be soldered with Pb-free paste using the
reflow profile shown in
Figure 2-2
.
NOTE: It is possible to solder a Pb-free package with Pb paste using a Standard
Eutectic profile with a reflow temperature maintained at 245
o
C – 250
o
C.
Figure 2-1: Standard Eutectic Solder Reflow Profile (Pb package, Pb paste)
Figure 2-2: Maximum Pb-free Solder Reflow Profile (Pb-free package, Pb-free
paste)
25C
100C
150C
183C
230C
220C
Time
Temperature
6 min. max
120 sec. max
60-150 sec.
10-20 sec.
3C/sec max
6C/sec max
25C
150C
200C
217C
260C
250C
Time
Temperature
8 min. max
60-180 sec. max
60-150 sec.
20-40 sec.
3C/sec max
6C/sec max
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