- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄16232 > EVAL-ADF4360-1EBZ1 (Analog Devices Inc)BOARD EVALUATION FOR ADF4360-1 PDF資料下載
參數(shù)資料
| 型號： | EVAL-ADF4360-1EBZ1 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 15/24頁 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION FOR ADF4360-1 |
| 標準包裝： | 1 |
| 主要目的： | 計時，頻率合成器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADF4360-1 |
| 主要屬性： | 帶 VCO 的單路整數(shù)-N PLL |
| 次要屬性： | 2.25GHz，200kHz PFD |
| 已供物品： | 板，線纜，軟件 |
| 相關(guān)產(chǎn)品： | ADF4360-1BCPZ-ND - IC SYNTHESIZER VCO 24-LFCSP ADF4360-1BCPZRL7-ND - IC SYNTHESIZER VCO 24LFCSP ADF4360-1BCPZRL-ND - IC SYNTHESIZER VCO 24LFCSP |
| 其它名稱： | Q4875592 Q5594761 |
ADF4360-1
Data Sheet
Rev. C | Page 22 of 24
PCB DESIGN GUIDELINES FOR CHIP-SCALE PACKAGE
The leads on the chip-scale package (CP-24) are rectangular.
The printed circuit board pad for these should be 0.1 mm long-
er than the package lead length and 0.05 mm wider than the
package lead width. The lead should be centered on the pad to
ensure that the solder joint size is maximized.
The bottom of the chip-scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern to ensure that short-
ing is avoided.
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at a
1.2 mm pitch grid. The via diameter should be between 0.3 mm
and 0.33 mm, and the via barrel should be plated with 1 ounce
of copper to plug the via.
The user should connect the printed circuit thermal pad to
AGND. This is internally connected to AGND.
OUTPUT MATCHING
There are a number of ways to match the output of the
ADF4360-1 for optimum operation; the most basic is to use a
50 resistor to VVCO. A dc bypass capacitor of 100 pF is con-
nected in series, as shown Figure 21. Because the resistor is not
frequency dependent, this provides a good broadband match.
The output power in this circuit typically gives 6 dBm output
power into a 50 load.
100pF
04414-025
RFOUT
VVCO
50
51
Figure 21. Simple ADF4360-1 Output Stage
A better solution is to use a shunt inductor (acting as an RF
choke) to VVCO. This gives a better match and hence more
output power. Additionally, a series inductor is added after the
dc bypass capacitor to provide a resonant LC circuit. This tunes
the oscillator output and provides approximately 10 dB addi-
tional rejection of the second harmonic. The shunt inductor
needs to be a relatively high value (>40 nH).
Experiments have shown that Figure 22 provides an excellent
match to 50 over the operating range of the ADF4360-1. This
gives approximately 4 dBm output power across the frequency
range of the ADF4360-1. Both single-ended architectures can
be examined using the EV-ADF4360-1EB1 evaluation board.
3.9nH
47nH
1.5pF
04414-026
RFOUT
VVCO
50
Figure 22. Optimum ADF4360-1 Output Stage
If the user does not need the differential outputs available on
the ADF4360-1, the user may either terminate the unused out-
put or combine both outputs using a balun. The circuit in Fig-
ure 23 shows how best to combine the outputs.
1nH
3.6nH
47nH
3.6nH
1.5pF
10pF
1.5pF
50
1nH
RFOUTA
VVCO
RFOUTB
04414-027
Figure 23. Balun for Combining ADF4360-1 RF Outputs
The circuit in Figure 23 is a lumped-lattice-type LC balun. It is
designed for a center frequency of 2.2 GHz and outputs 1.0 dBm
at this frequency. The series 1 nH inductor is used to tune out
any parasitic capacitance due to the board layout from each
input, and the remainder of the circuit is used to shift the
output of one RF input by +90° and the second by 90°, thus
combining the two. The action of the 3.6 nH inductor and the
1.5 pF capacitor accomplish this. The 47 nH is used to provide
an RF choke in order to feed the supply voltage, and the 10 pF
capacitor provides the necessary dc block. To ensure good RF
performance, the circuits in Figure 22 and Figure 23 were im-
plemented with Coilcraft 0402/0603 inductors and AVX 0402
thin-film capacitors.
Alternatively, instead of the LC balun shown in Figure 23, both
outputs may be combined using a 180° rat-race coupler.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| VE-J7V-EZ-F1 | CONVERTER MOD DC/DC 5.8V 25W |
| M3WWK-1440K | IDC CABLE - MPL14K/MC14F/MPL14K |
| MCP73223-C2SI/MF | IC LI IRON PHOSPHATE CTRLR 10DFN |
| VE-J7V-EY-S | CONVERTER MOD DC/DC 5.8V 50W |
| M3KKK-1440K | IDC CABLE - MPK14K/MC14F/MPK14K |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EVAL-ADF4360-2EB1 | 制造商:Analog Devices 功能描述:EVALUATION BOARD FOR ADF4360-2 |
| EVAL-ADF4360-2EBZ1 | 功能描述:BOARD EVALUATION FOR ADF4360-2 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估演示板和套件 系列:- 標準包裝:1 系列:PSoC® 主要目的:電源管理，熱管理 嵌入式:- 已用 IC / 零件:- 主要屬性:- 次要屬性:- 已供物品:板，CD，電源 |
| EVAL-ADF4360-3EB1 | 制造商:Analog Devices 功能描述:EVALUATION BOARD FOR ADF4360-3 |
| EVAL-ADF4360-4EB1 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Integrated Synthesizer and VCO |
| EVAL-ADF4360-4EBZ1 | 制造商:Analog Devices 功能描述:Evaluation Board Integrated Synthesizer And VCO 制造商:Analog Devices 功能描述:Evaluation Board I.C. |
發(fā)布緊急采購，3分鐘左右您將得到回復。